EP 3553573 A4 20200715 - METHOD FOR MANUFACTURING WAVELENGTH CONVERSION MEMBER, WAVELENGTH CONVERSION MEMBER, AND LIGHT-EMITTING DEVICE
Title (en)
METHOD FOR MANUFACTURING WAVELENGTH CONVERSION MEMBER, WAVELENGTH CONVERSION MEMBER, AND LIGHT-EMITTING DEVICE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES WELLENLÄNGENUMWANDLUNGSELEMENTS, WELLENLÄNGENUMWANDLUNGSELEMENT UND LICHTEMITTIERENDE VORRICHTUNG
Title (fr)
PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT DE CONVERSION DE LONGUEUR D'ONDE, ÉLÉMENT DE CONVERSION DE LONGUEUR D'ONDE ET DISPOSITIF ÉLECTROLUMINESCENT
Publication
Application
Priority
- JP 2016239326 A 20161209
- JP 2017041765 W 20171121
Abstract (en)
[origin: US2019280164A1] Provided are a method for manufacturing wavelength conversion members that enables manufacturing of wavelength conversion members having a high light extraction efficiency and suppression of material loss, a wavelength conversion member obtained by the method, and a light-emitting device. A method for manufacturing a plurality of wavelength conversion members by breaking into parts a base material 10 for the wavelength conversion members includes the steps of: preparing the base material 10 having a first principal surface 11 and a second principal surface 12 opposed to each other; forming a breaking groove 13 in the first principal surface 11; bonding a support 20 to the second principal surface 12 of the base material 10 having the breaking groove 13 formed in the first principal surface 11; pressing through the support 20 a region of the base material 10 where the breaking groove 13 is formed, thus breaking the base material 10 into the plurality of wavelength conversion members along the breaking groove 13; expanding the support 20 to form a gap between the plurality of wavelength conversion members lying on the support 20; and removing the plurality of wavelength conversion members from the support 20 after forming the gap.
IPC 8 full level
G02B 5/20 (2006.01); C09K 11/08 (2006.01); H01L 33/50 (2010.01)
CPC (source: EP KR US)
C09K 11/08 (2013.01 - EP KR US); G02B 5/20 (2013.01 - KR US); H01L 33/50 (2013.01 - KR US); H01L 33/501 (2013.01 - US); H01L 33/505 (2013.01 - EP); H01L 33/54 (2013.01 - EP); H01L 33/60 (2013.01 - EP); H01L 2933/0041 (2013.01 - EP US)
Citation (search report)
- [YA] DE 102015103571 A1 20160915 - OSRAM OPTO SEMICONDUCTORS GMBH [DE]
- [Y] EP 2680330 A2 20140101 - NITTO DENKO CORP [JP]
- [IAY] US 2014146547 A1 20140529 - TSUTSUMI YASUAKI [JP], et al
- [Y] KR 20160023052 A 20160303 - LG INNOTEK CO LTD [KR] & EP 3185314 A1 20170628 - LG INNOTEK CO LTD [KR]
- [Y] DE 102010048162 A1 20120412 - OSRAM OPTO SEMICONDUCTORS GMBH [DE]
- See also references of WO 2018105374A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 10818825 B2 20201027; US 2019280164 A1 20190912; CN 110050207 A 20190723; EP 3553573 A1 20191016; EP 3553573 A4 20200715; JP 2018097060 A 20180621; JP 6776859 B2 20201028; KR 102449025 B1 20220928; KR 20190088964 A 20190729; US 11322659 B2 20220503; US 2020411729 A1 20201231; WO 2018105374 A1 20180614
DOCDB simple family (application)
US 201716347285 A 20171121; CN 201780075652 A 20171121; EP 17878412 A 20171121; JP 2016239326 A 20161209; JP 2017041765 W 20171121; KR 20197002862 A 20171121; US 202017022359 A 20200916