EP 3553793 A1 20191016 - HIGH-BONDING STRENGTH COPPER-ALUMINUM COMPOSITE CONDUCTIVE MATERIAL AND PREPARATION METHOD THEREFOR
Title (en)
HIGH-BONDING STRENGTH COPPER-ALUMINUM COMPOSITE CONDUCTIVE MATERIAL AND PREPARATION METHOD THEREFOR
Title (de)
LEITFÄHIGER KUPFER-ALUMINIUM-VERBUNDSTOFF MIT HOHER HAFTFESTIGKEIT UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
MATÉRIAU CONDUCTEUR COMPOSITE CUIVRE-ALUMINIUM À HAUTE RÉSISTANCE DE LIAISON ET SON PROCÉDÉ DE PRÉPARATION
Publication
Application
Priority
- CN 201611114257 A 20161207
- CN 2016110430 W 20161216
Abstract (en)
Provided is a high-bonding strength copper-aluminum composite conductive material and a preparation method thereof. The high-bonding strength copper-aluminum composite conductive material includes a clad copper layer and an aluminum core matrix; an interatomic bonded metallurgical bonding layer is formed between the clad copper layer and the aluminum core matrix; the thickness of the bonding layer is 5∼35 µ m, and the bonding strength is ≥ 40Mpa; a copper-aluminum intermetallic compound is dispersedly distributed in the bonding layer; the components of a diffusion layer close to the clad copper layer are uniform, anda thickness is narrow; and a diffusion layer close to the aluminum core matrix is of a reticular structure formed by a mixture of two or more component phases, and a thickness is wide. The bonding between copper and aluminum in the copper-aluminum composite material achieves a metallurgical bonding state, and the corresponding bonding strength is greater than 40 MPa; a thickness of a side copper layer of the copper-aluminum composite material is about 1.6-2 times of a thickness of a planar copper layer; the thickness of the side clad copper layer is sufficient enough for large current impact and heat dissipation; and the elongation rate of the copper-aluminum composite material is greater than 30%; and the high-bonding strength copper-aluminum composite conductive material may carry out processing such as torsion, spiraling and side bending which are applied to the new field.
IPC 8 full level
H01B 1/02 (2006.01); B21C 37/04 (2006.01)
CPC (source: CN EP KR)
B21C 37/04 (2013.01 - CN EP KR); B22D 19/08 (2013.01 - KR); B22D 19/16 (2013.01 - KR); H01B 1/023 (2013.01 - CN EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3553793 A1 20191016; EP 3553793 A4 20200506; EP 3553793 B1 20220713; CN 106601324 A 20170426; CN 106601324 B 20171208; KR 102278579 B1 20210716; KR 20190091502 A 20190806; WO 2018103132 A1 20180614
DOCDB simple family (application)
EP 16923175 A 20161216; CN 2016110430 W 20161216; CN 201611114257 A 20161207; KR 20197019297 A 20161216