EP 3559752 A4 20200819 - FABRICATING UNIQUE CHIPS USING A CHARGED PARTICLE MULTI-BEAMLET LITHOGRAPHY SYSTEM
Title (en)
FABRICATING UNIQUE CHIPS USING A CHARGED PARTICLE MULTI-BEAMLET LITHOGRAPHY SYSTEM
Title (de)
HERSTELLUNG VON EINZIGARTIGEN CHIPS MIT EINEM LITHOGRAFIESYSTEM MIT MEHREREN LADUNGSTRÄGERTEILSTRAHLEN
Title (fr)
FABRICATION DE PUCES UNIQUES À L'AIDE D'UN SYSTÈME DE LITHOGRAPHIE À PETITS FAISCEAUX MULTIPLES DE PARTICULES CHARGÉES
Publication
Application
Priority
- US 201615389593 A 20161223
- US 201762458082 P 20170213
- JP 2017047416 W 20171222
Abstract (en)
[origin: WO2018117275A1] Method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer. The method comprises generating beamlet control data for controlling the maskless pattern writer to expose a wafer for creation of the electronic devices, wherein the beamlet control data is generated based on a feature data set defining features selectable for individualizing the electronic devices, wherein exposure of the wafer according to the beamlet control data results in exposing a pattern having a different selection of the features from the feature data set for different subsets of the electronic devices.
IPC 8 full level
G03F 7/20 (2006.01); H01J 37/302 (2006.01); H01J 37/317 (2006.01); H01L 21/82 (2006.01)
CPC (source: EP KR)
G03F 7/2059 (2013.01 - EP KR); G03F 7/70291 (2013.01 - EP KR); G03F 7/70508 (2013.01 - EP KR); H01J 37/3026 (2013.01 - EP KR); H01J 37/3177 (2013.01 - EP KR); H01J 2237/31762 (2013.01 - EP KR)
Citation (search report)
- [XAI] US 2006064191 A1 20060323 - NAYA HIDEMITSU [JP], et al
- [Y] US 2003141462 A1 20030731 - HARTLEY JOHN G [US]
- [A] US 2002160311 A1 20021031 - MURAKI MASATO [JP], et al
- [Y] JP S58116732 A 19830712 - FUJITSU LTD
- [XA] US 2015026650 A1 20150122 - YERIC GREGORY MUNSON [US]
- [A] PARKER N W ET AL: "A high throughput electron-beam direct-write lithography system", MICROLITHOGRAPHY WORLD, PENNWELL CORPORATION, US, vol. 9, no. 3, 1 January 2000 (2000-01-01), pages 22, 24 - 25, 30, XP009195346, ISSN: 1074-407X
- See also references of WO 2018117275A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2018117275 A1 20180628; CN 110268330 A 20190920; CN 110268330 B 20220128; CN 114355733 A 20220415; CN 114355733 B 20240315; EP 3559752 A1 20191030; EP 3559752 A4 20200819; KR 102359084 B1 20220207; KR 20190098222 A 20190821
DOCDB simple family (application)
JP 2017047416 W 20171222; CN 201780086059 A 20171222; CN 202210036020 A 20171222; EP 17884025 A 20171222; KR 20197021442 A 20171222