Global Patent Index - EP 3560039 A1

EP 3560039 A1 20191030 - CONDUCTOR CONNECTION, CONNECTION PIECE AND METHOD FOR PRODUCING A CONDUCTOR CONNECTION

Title (en)

CONDUCTOR CONNECTION, CONNECTION PIECE AND METHOD FOR PRODUCING A CONDUCTOR CONNECTION

Title (de)

LEITERVERBINDUNG, VERBINDUNGSSTÜCK UND VERFAHREN ZUR HERSTELLUNG EINER LEITERVERBINDUNG

Title (fr)

RACCORDEMENT DE CONDUCTEURS, PIÈCE DE CONNEXION ET PROCÉDÉ DE PRODUCTION D'UN RACCORDEMENT DE CONDUCTEURS

Publication

EP 3560039 A1 20191030 (DE)

Application

EP 17825771 A 20171211

Priority

  • DE 102016125647 A 20161223
  • EP 2017082231 W 20171211

Abstract (en)

[origin: WO2018114433A1] The invention relates to a conductor connection (100) comprising a connection part (1) and several electric conductors (2, 3). The connecting part (1) has two or more openings (7, 8). The conductors (2, 3) extend respectively through one of the openings (7, 8) into the connection part (1). The connection part (1) comprises a wall (11), the distance (a) thereof from a longitudinal axis (6) of the connection part (1) increasing to at least one of the openings (7, 8). The connection part (1) is designed in particular as a curved strip part (18) with overlapping lateral regions (14, 15).

IPC 8 full level

H01R 4/14 (2006.01); H01R 4/02 (2006.01); H01R 4/12 (2006.01); H01R 4/18 (2006.01); H01R 43/02 (2006.01)

CPC (source: EP US)

H01R 4/027 (2013.01 - US); H01R 4/14 (2013.01 - EP US); H01R 4/18 (2013.01 - EP US); H01R 4/183 (2013.01 - US); H01R 43/0263 (2013.01 - US); H01R 4/027 (2013.01 - EP); H01R 4/12 (2013.01 - EP US); H01R 43/0263 (2013.01 - EP)

Citation (search report)

See references of WO 2018114433A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2018114433 A1 20180628; CN 110301070 A 20191001; CN 110301070 B 20211228; DE 102016125647 A1 20180628; EP 3560039 A1 20191030; EP 3560039 B1 20211117; JP 2020502763 A 20200123; JP 6792713 B2 20201125; US 10892566 B2 20210112; US 2019312364 A1 20191010

DOCDB simple family (application)

EP 2017082231 W 20171211; CN 201780080237 A 20171211; DE 102016125647 A 20161223; EP 17825771 A 20171211; JP 2019533531 A 20171211; US 201716471377 A 20171211