EP 3561799 A1 20191030 - METHOD FOR MANUFACTURING FLEXIBLE ARRAY SUBSTRATE
Title (en)
METHOD FOR MANUFACTURING FLEXIBLE ARRAY SUBSTRATE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES FLEXIBLEN ARRAYSUBSTRATS
Title (fr)
PROCÉDÉ DE FABRICATION DE SUBSTRAT DE RÉSEAU SOUPLE
Publication
Application
Priority
- CN 201611184975 A 20161220
- CN 2016113371 W 20161230
Abstract (en)
Disclosed is a method for manufacturing a flexible array substrate. The method comprises: first attaching a flexible substrate (3) to a rigid support plate (1) to manufacture a back drive circuit (4) and manufacturing, on the back drive circuit (4), a protective layer (5); then, after tearing off and turning over the flexible substrate (3), re-attaching same to the rigid support plate (1), so that the protective layer (5) comes into contact with an adhesive layer (2); and then forming a via hole (6) in the flexible substrate (3) to manufacture a front drive circuit (7) and a display circuit, wherein the front drive circuit (7) is electrically connected to the display circuit, and the back drive circuit (4) is electrically connected to the display circuit by means of the via hole (6), thus manufacturing a flexible array substrate with circuit structures on two sides. By means of distributing circuit structures in a non-display region to two sides of the flexible substrate (3), the width of the non-display region can be reduced, thereby realising ultra-narrow border or borderless display.
IPC 8 full level
G09F 9/30 (2006.01); H10K 99/00 (2023.01)
CPC (source: CN EP KR US)
G02F 1/133305 (2013.01 - EP KR US); G02F 1/1345 (2013.01 - EP); G02F 1/13452 (2013.01 - KR); G02F 1/13454 (2013.01 - EP); G09F 9/301 (2013.01 - CN US); H05K 1/0218 (2013.01 - KR); H05K 1/0281 (2013.01 - US); H05K 1/189 (2013.01 - KR US); H05K 3/007 (2013.01 - US); H05K 3/28 (2013.01 - US); H10K 71/80 (2023.02 - EP); G02F 1/13452 (2013.01 - US); G02F 1/13613 (2021.01 - US); G02F 2201/42 (2013.01 - EP US); H10K 2102/311 (2023.02 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
US 10477689 B2 20191112; US 2018213648 A1 20180726; CN 106530972 A 20170322; CN 106530972 B 20171229; EP 3561799 A1 20191030; EP 3561799 A4 20200617; EP 3561799 B1 20210728; JP 2020504444 A 20200206; JP 6742523 B2 20200819; KR 102263432 B1 20210614; KR 20190097223 A 20190820; WO 2018113025 A1 20180628
DOCDB simple family (application)
US 201615503704 A 20161230; CN 201611184975 A 20161220; CN 2016113371 W 20161230; EP 16924891 A 20161230; JP 2019533224 A 20161230; KR 20197021197 A 20161230