EP 3564407 A1 20191106 - CYANIDE-FREE SUBSTITUTION GOLD PLATING SOLUTION COMPOSITION
Title (en)
CYANIDE-FREE SUBSTITUTION GOLD PLATING SOLUTION COMPOSITION
Title (de)
GOLDPLATTIERUNGSLÖSUNGSZUSAMMENSETZUNG DURCH CYANIDFREIE SUBSTITUTION
Title (fr)
COMPOSITION DE TYPE SOLUTION DE PLACAGE D'OR DE SUBSTITUTION SANS CYANURE
Publication
Application
Priority
JP 2016089007 W 20161227
Abstract (en)
A gold deposition accelerator for electroless gold plating comprising one or more alkali metal compound(s), wherein said alkali metal compound is not a compound comprising only sodium as an alkali metal, and said alkali metal compound is not only halide, only potassium sulfite, or only potassium sodium tartrate of an alkali metal, an electroless gold plating solution comprising said gold deposition accelerator, a gold plating method and a gold deposition accelerating method using the same and the like are provided.
IPC 8 full level
C23C 18/44 (2006.01)
CPC (source: EP KR US)
C23C 18/42 (2013.01 - EP KR US); C23C 18/44 (2013.01 - EP KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3564407 A1 20191106; EP 3564407 A4 20201021; CN 110114507 A 20190809; JP 6842475 B2 20210317; JP WO2018122989 A1 20191226; KR 20190096420 A 20190819; US 2021095378 A1 20210401; WO 2018122989 A1 20180705
DOCDB simple family (application)
EP 16925513 A 20161227; CN 201680091924 A 20161227; JP 2016089007 W 20161227; JP 2018558587 A 20161227; KR 20197021607 A 20161227; US 201616473764 A 20161227