EP 3570989 B1 20210310 - DEVICE FOR STAMPING BY MAGNETIC FORMING AND ASSOCIATED METHOD
Title (en)
DEVICE FOR STAMPING BY MAGNETIC FORMING AND ASSOCIATED METHOD
Title (de)
VORRICHTUNG ZUM STANZEN DURCH MAGNETISCHES FORMEN UND ZUGEHÖRIGES VERFAHREN
Title (fr)
DISPOSITIF D'EMBOUTISSAGE PAR MAGNÉTO-FORMAGE ET PROCÉDÉ ASSOCIÉ
Publication
Application
Priority
- FR 1750370 A 20170118
- EP 2018051134 W 20180117
Abstract (en)
[origin: WO2018134271A1] The invention relates to a device (10) for stamping a blank (50) in order to produce a stamped part. The device includes a punch (21) including a bearing surface (211), an anvil (22), and means for generating a magnetic field (34). The stamping device being configured, in an initial position, so that: the bearing surface (211) of the punch (21) is intended for receiving a portion of a first surface (51) of the blank (50); the anvil and the means for generating a magnetic field are intended for being arranged on either side of another portion of the blank, with the anvil (22) facing the first surface (51), and the means for generating a magnetic field facing a second surface (52) opposite the first surface. The means for generating a magnetic field (34) are capable of applying a pressure on the blank (50) towards the anvil, in a direction ZZ'. The stamping device also includes movement means (23) arranged to move the punch (21), relative to the means for generating a magnetic field (34), in a direction opposite the direction ZZ'.
IPC 8 full level
B21D 22/21 (2006.01); B21D 26/14 (2006.01)
CPC (source: EP US)
B21D 22/21 (2013.01 - EP US); B21D 26/14 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
FR 3061863 A1 20180720; FR 3061863 B1 20190524; CN 110177632 A 20190827; CN 110177632 B 20211008; EP 3570989 A1 20191127; EP 3570989 B1 20210310; JP 2020514066 A 20200521; US 2019374992 A1 20191212; WO 2018134271 A1 20180726
DOCDB simple family (application)
FR 1750370 A 20170118; CN 201880007179 A 20180117; EP 18700764 A 20180117; EP 2018051134 W 20180117; JP 2019538239 A 20180117; US 201816478661 A 20180117