Global Patent Index - EP 3571795 A4

EP 3571795 A4 20200304 - LOCATION OF INTERLEAVER WITH LDPC CODE

Title (en)

LOCATION OF INTERLEAVER WITH LDPC CODE

Title (de)

STANDORT VON INTERLEAVER MIT LDPC-CODE

Title (fr)

EMPLACEMENT D'ENTRELACEUR AVEC CODE LDPC

Publication

EP 3571795 A4 20200304 (EN)

Application

EP 18744752 A 20180124

Priority

  • US 201762449677 P 20170124
  • US 201762522149 P 20170620
  • US 201815878350 A 20180123
  • CN 2018073963 W 20180124

Abstract (en)

[origin: US2018212626A1] Concepts and schemes pertaining to location of interleaver with low-density parity-check (LDPC) code are described. A processor of an apparatus encodes data to provide a stream of encoded data. The processor also rate matches the encoded data to provide a rate-matched stream of encoded data. The processor further interleaving the rate-matched stream of encoded data. In rate matching the encoded data, the processor buffers the stream of encoded data in a circular buffer, with the circular buffer functioning as a rate matching block that rate matches the stream of encoded data. In interleaving the rate-matched stream of encoded data, the processor performs bit-level interleaving on the rate-matched stream of encoded data to provide a stream of interleaved data.

IPC 8 full level

H03M 13/11 (2006.01); H03M 13/27 (2006.01); H04L 1/00 (2006.01)

CPC (source: EP US)

H03M 13/1102 (2013.01 - EP US); H03M 13/116 (2013.01 - EP US); H03M 13/27 (2013.01 - EP US); H03M 13/2906 (2013.01 - US); H03M 13/6362 (2013.01 - EP US); H03M 13/6393 (2013.01 - US)

Citation (search report)

  • [XI] EP 2938035 A1 20151028 - SAMSUNG ELECTRONICS CO LTD [KR]
  • [XI] US 2015082117 A1 20150319 - MYUNG SE-HO [KR], et al
  • [XI] WO 2009094805 A1 20090806 - PANASONIC CORP [JP], et al
  • [XI] US 2008320353 A1 20081225 - BLANKENSHIP YUFEI W [US], et al
  • [XPAI] MEDIATEK INC: "On design of bit-level interleaver", vol. RAN WG1, no. Prague, Czech; 20170821 - 20170825, 20 August 2017 (2017-08-20), XP051316509, Retrieved from the Internet <URL:http://www.3gpp.org/ftp/Meetings_3GPP_SYNC/RAN1/Docs/> [retrieved on 20170820]
  • [XPAI] SAMSUNG: "Bit-level interleaver of LDPC codes on high order modulation", vol. RAN WG1, no. Prague, Czechia; 20170821 - 20170825, 26 August 2017 (2017-08-26), XP051328161, Retrieved from the Internet <URL:http://www.3gpp.org/ftp/tsg_ran/WG1_RL1/TSGR1_90/Docs/> [retrieved on 20170826]
  • [XPAI] NOKIA ET AL: "Interleaving for LDPC", vol. RAN WG1, no. Qingdao, P.R. China; 20170627 - 20170630, 19 June 2017 (2017-06-19), XP051305706, Retrieved from the Internet <URL:http://www.3gpp.org/ftp/tsg_ran/WG1_RL1/TSGR1_AH/NR_AH_1706/Docs/> [retrieved on 20170619]
  • [XAI] SAMSUNG ELECTRONICS: "pCR 45.820 NB OFDMA - Uplink Forward Error Correction", vol. TSG GERAN, no. Kista,Sweden; 20150629 - 20150702, 24 June 2015 (2015-06-24), XP051625496, Retrieved from the Internet <URL:http://www.3gpp.org/ftp/tsg%5Fgeran/TSG%5FGERAN/AD%2DHOCs/Ad%2Dhoc%5FGERAN1%2DGERAN2%5FCIoT/Docs/GPC150319%2Ezip> [retrieved on 20150624]
  • See references of WO 2018137646A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

US 10432227 B2 20191001; US 2018212626 A1 20180726; CN 108633326 A 20181009; EP 3571795 A1 20191127; EP 3571795 A4 20200304; TW 201834403 A 20180916; US 10958290 B2 20210323; US 2019372600 A1 20191205; WO 2018137646 A1 20180802

DOCDB simple family (application)

US 201815878350 A 20180123; CN 2018073963 W 20180124; CN 201880000468 A 20180124; EP 18744752 A 20180124; TW 107102523 A 20180124; US 201916543783 A 20190819