EP 3574724 A4 20200826 - DUMMY ELECTRONIC COMPONENT
Title (en)
DUMMY ELECTRONIC COMPONENT
Title (de)
DUMMY-ELEKTRONIKKOMPONENTE
Title (fr)
COMPOSANT ÉLECTRONIQUE FACTICE
Publication
Application
Priority
US 2017015055 W 20170126
Abstract (en)
[origin: WO2018140017A1] An example device includes a planar circuit board with a first surface and a second surface opposite the first surface, an electrical circuit on at least one of the first surface or the second surface, and at least one dummy electronic component mounted on the first surface. The electrical circuit includes at least one electronic component. The dummy electronic component is electrically isolated from the electrical circuit. The dummy electronic component has a protrusion from the planar circuit board that is greater than protrusion of each of the at least one electronic component of the electrical circuit.
IPC 8 full level
H05K 1/18 (2006.01)
CPC (source: EP US)
H05K 1/115 (2013.01 - US); H05K 1/181 (2013.01 - EP US); H05K 3/303 (2013.01 - US); H05K 2201/10022 (2013.01 - EP US); H05K 2201/10204 (2013.01 - EP US); H05K 2201/10636 (2013.01 - EP); H05K 2201/2036 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP)
Citation (search report)
- [XI] US 2009180263 A1 20090716 - ERIKSEN CHRISTOPHER LEE [US], et al
- [XI] JP H06112621 A 19940422 - FUJITSU LTD
- [XI] US 2009145637 A1 20090611 - KANOUDA AKIHIKO [JP], et al
- [XI] US 2006023437 A1 20060202 - NISHIDA KAZUFUMI [JP]
- See references of WO 2018140017A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2018140017 A1 20180802; CN 110073728 A 20190730; EP 3574724 A1 20191204; EP 3574724 A4 20200826; US 2019373731 A1 20191205
DOCDB simple family (application)
US 2017015055 W 20170126; CN 201780077704 A 20170126; EP 17893862 A 20170126; US 201716462718 A 20170126