Global Patent Index - EP 3579537 A4

EP 3579537 A4 20201104 - CAMERA MODULE AND MOLDED CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND APPLICATION THEREOF

Title (en)

CAMERA MODULE AND MOLDED CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND APPLICATION THEREOF

Title (de)

KAMERAMODUL UND GEFORMTE LEITERPLATTENANORDNUNG, LEITERPLATTE UND ANWENDUNG DAVON

Title (fr)

ENSEMBLE DE MODULE DE CAMÉRA ET DE CARTE DE CIRCUIT IMPRIMÉ MOULÉ, CARTE DE CIRCUIT IMPRIMÉ ET APPLICATION ASSOCIÉE

Publication

EP 3579537 A4 20201104 (EN)

Application

EP 18748678 A 20180205

Priority

  • CN 201710064137 A 20170204
  • CN 2018075334 W 20180205

Abstract (en)

[origin: EP3579537A1] The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

IPC 8 full level

H04N 5/225 (2006.01); G01S 17/36 (2006.01); H05K 1/02 (2006.01)

CPC (source: CN EP KR US)

G01S 17/36 (2013.01 - KR); H04N 23/54 (2023.01 - CN EP KR); H04N 23/55 (2023.01 - CN EP KR US); H04N 23/57 (2023.01 - CN KR US); H05K 1/02 (2013.01 - KR); H05K 1/0216 (2013.01 - EP); H05K 1/181 (2013.01 - US); H05K 3/303 (2013.01 - US); H01L 2224/48227 (2013.01 - EP); H05K 1/0274 (2013.01 - EP); H05K 2201/09972 (2013.01 - EP); H05K 2201/10121 (2013.01 - EP US); H05K 2201/10151 (2013.01 - US); H05K 2201/10424 (2013.01 - US); H05K 2203/1327 (2013.01 - EP)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 3579537 A1 20191211; EP 3579537 A4 20201104; CN 108401091 A 20180814; CN 108401091 B 20220628; CN 108401092 A 20180814; CN 108401092 B 20240315; CN 110089102 A 20190802; CN 110089102 B 20210810; CN 209089073 U 20190709; CN 209105276 U 20190712; JP 2020509580 A 20200326; JP 7104711 B2 20220721; KR 102303294 B1 20210915; KR 102350661 B1 20220114; KR 102431381 B1 20220811; KR 20190112079 A 20191002; KR 20210011079 A 20210129; KR 20210106020 A 20210827; US 11039052 B2 20210615; US 11451693 B2 20220920; US 2020244852 A1 20200730; US 2021266436 A1 20210826; WO 2018141295 A1 20180809

DOCDB simple family (application)

EP 18748678 A 20180205; CN 2018075334 W 20180205; CN 201810113144 A 20180205; CN 201810114368 A 20180205; CN 201820199284 U 20180205; CN 201820199318 U 20180205; CN 201880005176 A 20180205; JP 2019542096 A 20180205; KR 20197025226 A 20180205; KR 20217002179 A 20180205; KR 20217026115 A 20180205; US 201816483150 A 20180205; US 202117314723 A 20210507