EP 3581002 A1 20191218 - METHOD AND DEVICE FOR EMBEDDING AT LEAST ONE ELECTRONIC COMPONENT IN A SUBSTRATE
Title (en)
METHOD AND DEVICE FOR EMBEDDING AT LEAST ONE ELECTRONIC COMPONENT IN A SUBSTRATE
Title (de)
VERFAHREN UND VORRICHTUNG ZUM EINBETTEN MINDESTENS EINES ELEKTRONISCHEN BAUELEMENTS IN EINEM TRÄGER
Title (fr)
PROCÉDÉ ET DISPOSITIF PERMETTANT D'INCORPORER AU MOINS UN COMPOSANT ÉLECTRONIQUE DANS UN SUPPORT
Publication
Application
Priority
- DE 102017202000 A 20170208
- EP 2018053045 W 20180207
Abstract (en)
[origin: WO2018146130A1] The present invention relates to a method and a device for embedding at least one electronic component (1) into a substrate (2). In this respect, the at least one component (1) is fixed in or on a receiving unit (3), and the substrate (2) is produced by applying a substrate material into or onto the receiving unit (3) in layers, the at least one component (1) being embedded into the substrate material as the result of said application in layers.
IPC 8 full level
H05K 1/02 (2006.01); B29C 64/00 (2017.01); B29C 70/72 (2006.01); H01L 23/31 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/14 (2006.01)
CPC (source: EP)
B29C 70/72 (2013.01); B33Y 80/00 (2014.12); H01L 21/56 (2013.01); H05K 1/0284 (2013.01); H05K 1/183 (2013.01); H05K 1/185 (2013.01); H05K 3/0014 (2013.01); H01L 23/3107 (2013.01); H05K 1/0221 (2013.01); H05K 3/107 (2013.01); H05K 3/1241 (2013.01); H05K 3/14 (2013.01)
Citation (search report)
See references of WO 2018146130A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102017202000 A1 20180809; EP 3581002 A1 20191218; WO 2018146130 A1 20180816
DOCDB simple family (application)
DE 102017202000 A 20170208; EP 18703987 A 20180207; EP 2018053045 W 20180207