EP 3583623 A1 20191225 - SOLDER PREFORM FOR DIFFUSION SOLDERING, METHOD FOR THE PRODUCTION THEREOF AND METHOD FOR THE ASSEMBLY THEREOF
Title (en)
SOLDER PREFORM FOR DIFFUSION SOLDERING, METHOD FOR THE PRODUCTION THEREOF AND METHOD FOR THE ASSEMBLY THEREOF
Title (de)
LOTFORMTEIL ZUM DIFFUSIONSLÖTEN, VERFAHREN ZU DESSEN HERSTELLUNG UND VERFAHREN ZU DESSEN MONTAGE
Title (fr)
PIÈCE MOULÉE DE SOUDURE POUR LE SOUDAGE PAR DIFFUSION, SON PROCÉDÉ DE FABRICATION ET SON PROCÉDÉ DE MONTAGE
Publication
Application
Priority
- DE 102017206930 A 20170425
- EP 2018059971 W 20180419
Abstract (en)
[origin: WO2018197314A1] The invention relates to a solder preform (11) for diffusion soldering. This consists of metal films (12), between which a paste (16) containing particles (15) is retained. The particles can consist of a soldering material, for example, while the films (12) consist of copper, for example. With the forming of the solder connection, intermetallic connections of the diffusion solder connection occur in a diffusion zone. The advantage of the use of a paste for producing the sandwich structure in the solder preform (11) lies in the fact that production is simplified and the paste (16) can guarantee a tolerance compensation to a certain extent. As well as the solder preform (11), the invention also relates to a method for producing a solder preform of this type, and a method for forming a diffusion solder connection with this solder preform.
IPC 8 full level
H01L 23/488 (2006.01); H01L 21/00 (2006.01); H01L 23/00 (2006.01); H05K 3/20 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP KR US)
B23K 1/19 (2013.01 - EP KR); B23K 35/0238 (2013.01 - EP KR); B23K 35/0244 (2013.01 - EP); B23K 35/025 (2013.01 - EP KR US); B23K 35/262 (2013.01 - EP KR); B23K 35/302 (2013.01 - EP KR); B23K 35/3033 (2013.01 - EP KR); B32B 15/16 (2013.01 - US); H01L 24/13 (2013.01 - KR); H01L 24/29 (2013.01 - EP KR US); H01L 24/83 (2013.01 - US); B23K 2103/12 (2018.07 - EP); H01L 24/05 (2013.01 - EP); H01L 24/27 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/33 (2013.01 - EP); H01L 24/83 (2013.01 - EP); H01L 2224/04026 (2013.01 - EP); H01L 2224/05647 (2013.01 - EP); H01L 2224/271 (2013.01 - EP); H01L 2224/29006 (2013.01 - US); H01L 2224/2908 (2013.01 - EP US); H01L 2224/29111 (2013.01 - EP); H01L 2224/29294 (2013.01 - EP); H01L 2224/293 (2013.01 - EP); H01L 2224/29311 (2013.01 - EP); H01L 2224/29347 (2013.01 - EP); H01L 2224/32227 (2013.01 - EP); H01L 2224/32245 (2013.01 - EP); H01L 2224/33181 (2013.01 - EP); H01L 2224/83447 (2013.01 - EP); H01L 2224/8382 (2013.01 - US); H01L 2224/83825 (2013.01 - EP); H05K 3/207 (2013.01 - EP); H05K 3/3478 (2013.01 - EP); H05K 3/3485 (2020.08 - EP); H05K 2203/0415 (2013.01 - EP)
Citation (search report)
See references of WO 2018197314A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102017206930 A1 20181025; CN 110546759 A 20191206; EP 3583623 A1 20191225; JP 2020518456 A 20200625; JP 6927638 B2 20210901; KR 102226143 B1 20210309; KR 20190129940 A 20191120; US 2020139490 A1 20200507; WO 2018197314 A1 20181101
DOCDB simple family (application)
DE 102017206930 A 20170425; CN 201880026907 A 20180419; EP 18722915 A 20180419; EP 2018059971 W 20180419; JP 2019558363 A 20180419; KR 20197030389 A 20180419; US 201816607543 A 20180419