EP 3584352 A4 20210106 - COMPOSITION FOR PRETREATMENT FOR ELECTROLESS PLATING, PRETREATMENT METHOD FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD
Title (en)
COMPOSITION FOR PRETREATMENT FOR ELECTROLESS PLATING, PRETREATMENT METHOD FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD
Title (de)
ZUSAMMENSETZUNG ZUR VORBEHANDLUNG FÜR STROMLOSES PLATTIEREN, VORBEHANDLUNGSVERFAHREN FÜR STROMLOSES PLATTIEREN UND STROMLOSES PLATTIERUNGSVERFAHREN
Title (fr)
COMPOSITION DE PRÉTRAITEMENT POUR DÉPOSITION AUTOCATALYTIQUE, PROCÉDÉ DE PRÉTRAITEMENT POUR DÉPOSITION AUTOCATALYTIQUE, ET PROCÉDÉ DE DÉPOSITION AUTOCATALYTIQUE
Publication
Application
Priority
- JP 2017102106 A 20170523
- JP 2018019776 W 20180523
Abstract (en)
[origin: EP3584352A1] The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.
IPC 8 full level
C23C 18/30 (2006.01); C23C 18/20 (2006.01); C23C 18/24 (2006.01); C23C 18/34 (2006.01); C23C 18/40 (2006.01)
CPC (source: CN EP KR US)
C23C 18/206 (2013.01 - CN KR); C23C 18/2066 (2013.01 - CN); C23C 18/208 (2013.01 - CN KR); C23C 18/2086 (2013.01 - CN EP); C23C 18/24 (2013.01 - CN EP); C23C 18/30 (2013.01 - CN EP US); C23C 18/34 (2013.01 - CN EP US); C23C 18/40 (2013.01 - CN US); C23C 18/405 (2013.01 - CN EP); C23C 18/44 (2013.01 - CN KR)
Citation (search report)
- [A] US 2016102403 A1 20160414 - WEITERSHAUS KATHARINA [CH], et al
- [A] US 2016024381 A1 20160128 - SCHILDMANN MARK PETER [DE], et al
- [A] US 5112513 A 19920512 - BRESSEL BURKHARD [DE], et al
- See also references of WO 2018216714A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3584352 A1 20191225; EP 3584352 A4 20210106; EP 3584352 B1 20230621; CN 110573657 A 20191213; CN 113373432 A 20210910; CN 117904611 A 20240419; CN 118064879 A 20240524; ES 2953783 T3 20231116; JP 6482049 B1 20190313; JP WO2018216714 A1 20190627; KR 102366687 B1 20220223; KR 20190137146 A 20191210; KR 20200134345 A 20201201; MY 176735 A 20200820; PL 3584352 T3 20230925; PT 3584352 T 20230726; US 2020407854 A1 20201231; WO 2018216714 A1 20181129
DOCDB simple family (application)
EP 18806217 A 20180523; CN 201880028555 A 20180523; CN 202110654779 A 20180523; CN 202410090911 A 20180523; CN 202410208179 A 20180523; ES 18806217 T 20180523; JP 2018019776 W 20180523; JP 2018549365 A 20180523; KR 20197033554 A 20180523; KR 20207033666 A 20180523; MY PI2019005194 A 20180523; PL 18806217 T 20180523; PT 18806217 T 20180523; US 201816493480 A 20180523