Global Patent Index - EP 3585921 A1

EP 3585921 A1 20200101 - EVAPORATION SOURCE WITH COOLING ASSEMBLY

Title (en)

EVAPORATION SOURCE WITH COOLING ASSEMBLY

Title (de)

VERDAMPFUNGSQUELLE MIT KÜHLANORDNUNG

Title (fr)

SOURCE D'ÉVAPORATION AVEC ENSEMBLE DE REFROIDISSEMENT

Publication

EP 3585921 A1 20200101 (EN)

Application

EP 18705007 A 20180220

Priority

  • EP 17157223 A 20170221
  • EP 2018054141 W 20180220

Abstract (en)

[origin: WO2018153853A1] A modular demountable low-temperature high-output linear evaporation source (100) for depositing a semi-metal source material (75), in particular Se, on a substrate (50), the evaporation source comprising: a crucible (201) comprising: a base (203); a first plurality of walls (202) surrounding an interior region (204) of the crucible (201), the plurality of walls (202) including a first end wall (2021), a second end wall (2022) opposite to the first end wall (2021), a first side wall (2023), and a second side wall (2024) opposite to the first side wall (2023); a cooling assembly (600) comprising: a cooling plate (602) disposed below the base (203) of the crucible (201), the cooling plate (602) having a lower surface (606) including one or more grooves (608); and a first cooling tube (604) disposed in the one or more grooves (608) of the lower surface (606).

IPC 8 full level

C23C 14/24 (2006.01); C23C 14/06 (2006.01); C23C 14/54 (2006.01); C23C 14/56 (2006.01)

CPC (source: EP)

C23C 14/0623 (2013.01); C23C 14/243 (2013.01); C23C 14/541 (2013.01); C23C 14/562 (2013.01)

Citation (search report)

See references of WO 2018153853A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2018153853 A1 20180830; EP 3585921 A1 20200101

DOCDB simple family (application)

EP 2018054141 W 20180220; EP 18705007 A 20180220