EP 3589094 A1 20200101 - ELECTRONIC UNIT AND METHOD OF MAKING THE SAME
Title (en)
ELECTRONIC UNIT AND METHOD OF MAKING THE SAME
Title (de)
ELEKTRONISCHE EINHEIT UND VERFAHREN ZUR HERSTELLUNG DAVON
Title (fr)
UNITÉ ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
JP 2018122751 A 20180628
Abstract (en)
A digital amplifier IC, which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.
IPC 8 full level
CPC (source: CN EP US)
B29C 45/14336 (2013.01 - US); H03F 1/30 (2013.01 - US); H03F 3/187 (2013.01 - US); H05K 1/0203 (2013.01 - US); H05K 1/181 (2013.01 - US); H05K 3/284 (2013.01 - US); H05K 5/0034 (2013.01 - CN EP); H05K 7/20854 (2013.01 - EP US); H05K 7/209 (2013.01 - CN); B29L 2031/34 (2013.01 - US); H03F 2200/03 (2013.01 - US); H05K 2201/066 (2013.01 - US); H05K 2201/10015 (2013.01 - US); H05K 2201/10522 (2013.01 - US); H05K 2203/1316 (2013.01 - US); H05K 2203/1327 (2013.01 - EP US)
Citation (applicant)
WO 2017056722 A1 20170406 - HITACHI AUTOMOTIVE SYSTEMS LTD [JP]
Citation (search report)
- [XI] EP 1677583 A1 20060705 - HITACHI LTD [JP]
- [XI] DE 102015217572 B3 20170316 - CONTI TEMIC MICROELECTRONIC GMBH [DE]
- [A] DE 102013215368 A1 20150205 - ZAHNRADFABRIK FRIEDRICHSHAFEN [DE]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3589094 A1 20200101; CN 110662372 A 20200107; JP 2020004840 A 20200109; US 10595393 B2 20200317; US 2020008292 A1 20200102
DOCDB simple family (application)
EP 19182276 A 20190625; CN 201910479900 A 20190604; JP 2018122751 A 20180628; US 201916411696 A 20190514