Global Patent Index - EP 3589094 A1

EP 3589094 A1 20200101 - ELECTRONIC UNIT AND METHOD OF MAKING THE SAME

Title (en)

ELECTRONIC UNIT AND METHOD OF MAKING THE SAME

Title (de)

ELEKTRONISCHE EINHEIT UND VERFAHREN ZUR HERSTELLUNG DAVON

Title (fr)

UNITÉ ÉLECTRONIQUE ET SON PROCÉDÉ DE FABRICATION

Publication

EP 3589094 A1 20200101 (EN)

Application

EP 19182276 A 20190625

Priority

JP 2018122751 A 20180628

Abstract (en)

A digital amplifier IC, which is a heat-generating electronic component, is mounted on an upper surface of an insulating substrate. The digital amplifier IC is disposed inside a recess of a heat sink. The heat sink includes a peripheral wall having an end face placed on the upper surface of the insulating substrate. A hot-melt resin layer, molded by hot-melt molding, covers the upper surface of the insulating substrate. The hot-melt resin layer is in contact with a side face of the peripheral wall and retains the heat sink on the insulating substrate. The recess of the heat sink has no hot-melt resin therein.

IPC 8 full level

H05K 5/00 (2006.01); H05K 7/20 (2006.01)

CPC (source: CN EP US)

B29C 45/14336 (2013.01 - US); H03F 1/30 (2013.01 - US); H03F 3/187 (2013.01 - US); H05K 1/0203 (2013.01 - US); H05K 1/181 (2013.01 - US); H05K 3/284 (2013.01 - US); H05K 5/0034 (2013.01 - CN EP); H05K 7/20854 (2013.01 - EP US); H05K 7/209 (2013.01 - CN); B29L 2031/34 (2013.01 - US); H03F 2200/03 (2013.01 - US); H05K 2201/066 (2013.01 - US); H05K 2201/10015 (2013.01 - US); H05K 2201/10522 (2013.01 - US); H05K 2203/1316 (2013.01 - US); H05K 2203/1327 (2013.01 - EP US)

Citation (applicant)

WO 2017056722 A1 20170406 - HITACHI AUTOMOTIVE SYSTEMS LTD [JP]

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3589094 A1 20200101; CN 110662372 A 20200107; JP 2020004840 A 20200109; US 10595393 B2 20200317; US 2020008292 A1 20200102

DOCDB simple family (application)

EP 19182276 A 20190625; CN 201910479900 A 20190604; JP 2018122751 A 20180628; US 201916411696 A 20190514