EP 3594995 A1 20200115 - WAFER FEED DEVICE
Title (en)
WAFER FEED DEVICE
Title (de)
WAFERZUFÜHRVORRICHTUNG
Title (fr)
DISPOSITIF D'ALIMENTATION EN TRANCHE
Publication
Application
Priority
JP 2017009617 W 20170309
Abstract (en)
A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device includes a die information storage section configured to store the number of dies for each rank allocated to each of the dies, a block information acquisition section configured to acquire a condition of dies to be mounted on a block provided on a board to be conveyed, a required block number acquisition section configured to acquire a required number of dies to be mounted on the block, and a producible number calculation section configured to calculate a number of blocks that can be produced based on a content stored in the die information storage section and a content acquired by the block information acquisition section and the required block number acquisition section.
IPC 8 full level
H01L 21/67 (2006.01); H01L 21/52 (2006.01)
CPC (source: EP US)
B65G 47/91 (2013.01 - US); G05B 19/4183 (2013.01 - US); H01L 21/52 (2013.01 - EP); H01L 21/67144 (2013.01 - EP US); H01L 21/67294 (2013.01 - US); G05B 2219/45031 (2013.01 - US); G05B 2219/45063 (2013.01 - US); H01L 21/67271 (2013.01 - EP); H01L 21/67294 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3594995 A1 20200115; EP 3594995 A4 20200304; EP 3594995 B1 20210421; CN 110419100 A 20191105; CN 110419100 B 20230526; JP 6698213 B2 20200527; JP WO2018163389 A1 20191107; US 11239101 B2 20220201; US 2020013651 A1 20200109; WO 2018163389 A1 20180913
DOCDB simple family (application)
EP 17899570 A 20170309; CN 201780088029 A 20170309; JP 2017009617 W 20170309; JP 2019504254 A 20170309; US 201716490952 A 20170309