EP 3599294 A1 20200129 - COMPOSITIONS AND METHODS FOR ELECTRODEPOSITING TIN-BISMUTH ALLOYS ON METALLIC SUBSTRATES
Title (en)
COMPOSITIONS AND METHODS FOR ELECTRODEPOSITING TIN-BISMUTH ALLOYS ON METALLIC SUBSTRATES
Title (de)
ZUSAMMENSETZUNGEN UND VERFAHREN ZUR ELEKTROABSCHEIDUNG VON ZINNWISMUTLEGIERUNGEN AUF METALLISCHEN SUBSTRATEN
Title (fr)
COMPOSITIONS ET PROCÉDÉS POUR LE DÉPÔT GALVANIQUE D'ALLIAGES D'ÉTAIN-BISMUTH SUR DES SUBSTRATS MÉTALLIQUES
Publication
Application
Priority
US 201816045211 A 20180725
Abstract (en)
A method for depositing a tin-bismuth alloy on a substrate, the method including steps of (1) immersing the substrate and an anode in an electrolyte solution that includes water, a stannous salt, a bismuth salt, and at least one of sulfuric acid and sulfamic acid, the anode including tin and, optionally, bismuth, and (2) passing an electric current between the substrate and the anode to form a deposit on the substrate.
IPC 8 full level
C25D 3/60 (2006.01)
CPC (source: CN EP US)
C25D 3/60 (2013.01 - CN EP US); C25D 5/38 (2013.01 - CN US); C25D 17/10 (2013.01 - US)
Citation (search report)
- [X] SU 1794110 A3 19930207 - SAMARSKIJ G UNI [SU]
- [X] BG 31570 A1 19820215 - JJORDANOV [BG], et al
- [X] CN 102517616 B 20141119 - ANHUI HUADONG PHOTOELEC TECH
- [X] JP H07138782 A 19950530 - DIPSOL CHEM
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3599294 A1 20200129; EP 3599294 B1 20230308; EP 3599294 B8 20230412; CN 110777405 A 20200211; JP 2020037738 A 20200312; US 2020032409 A1 20200130
DOCDB simple family (application)
EP 19188272 A 20190725; CN 201910661565 A 20190722; JP 2019136663 A 20190725; US 201816045211 A 20180725