EP 3610503 A1 20200219 - ELECTRONIC POWER MODULE AND ELECTRICAL POWER CONVERTER INCORPORATING SAME
Title (en)
ELECTRONIC POWER MODULE AND ELECTRICAL POWER CONVERTER INCORPORATING SAME
Title (de)
ELEKTRONISCHES LEISTUNGSMODUL UND ELEKTRISCHER LEISTUNGSWANDLER DAMIT
Title (fr)
MODULE ÉLECTRONIQUE DE PUISSANCE ET CONVERTISSEUR ÉLECTRIQUE DE PUISSANCE L'INCORPORANT
Publication
Application
Priority
- FR 1753254 A 20170413
- FR 2018050883 W 20180409
Abstract (en)
[origin: WO2018189468A1] The module (PM1) has an architecture with 3D stacking of the electronic power switching chips (IT, ID) and comprises first and second dielectric substrates (SH, SL) that are intended to come into thermal contact with first and second heat sinks (DH, DL), respectively, at least one pair of first and second stacked electronic power switching chips (ITHS, IDHS; ITHS, IDHS) and a common intermediate substrate (SC), the first and second electronic power switching chips being sandwiched between the first dielectric substrate and the common intermediate substrate and between the common intermediate substrate and the second dielectric substrate, respectively. According to the invention, the common intermediate substrate is a metal element formed as a single piece and comprises a central portion for the implantation of the electronic power switching chips and at least one thermal conduction portion that is in thermal contact with the first dielectric substrate and/or the second dielectric substrate.
IPC 8 full level
H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP US)
F28D 15/04 (2013.01 - US); H01L 23/367 (2013.01 - EP); H01L 23/427 (2013.01 - US); H01L 25/071 (2013.01 - EP US); H01L 25/18 (2013.01 - EP); H01L 2023/4068 (2013.01 - EP); H01L 2224/33 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP); H01L 2924/181 (2013.01 - EP)
Citation (search report)
See references of WO 2018189468A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2018189468 A1 20181018; CN 110506330 A 20191126; CN 110506330 B 20230530; EP 3610503 A1 20200219; FR 3065319 A1 20181019; FR 3065319 B1 20190426; US 10714406 B2 20200714; US 2020152547 A1 20200514
DOCDB simple family (application)
FR 2018050883 W 20180409; CN 201880025047 A 20180409; EP 18723901 A 20180409; FR 1753254 A 20170413; US 201816604524 A 20180409