EP 3610705 A1 20200219 - PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD ASSEMBLY
Title (en)
PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD ASSEMBLY
Title (de)
LEITERPLATTEN-ANORDNUNG SOWIE VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTEN-ANORDNUNG
Title (fr)
SYSTÈME DE PLAQUES Á CIRCUITS IMPRIMÉS AINSI QUE PROCÉDÉ DE FABRICATION D'UN SYSTÈME DE PLAQUES Á CIRCUITS IMPRIMÉS
Publication
Application
Priority
- DE 102017206099 A 20170410
- EP 2018057110 W 20180321
Abstract (en)
[origin: WO2018188918A1] The invention relates to a printed circuit board assembly (1) for an electronic circuit. The printed circuit board assembly (100) comprises a first printed circuit board (110) having one or more electrically conductive first contact points (111) on a front side (114) of the first printed circuit board (110). In addition, the printed circuit board assembly (100) comprises a second printed circuit board (120) having one or more electrically conductive second contact points (121) on a rear side (123) of the second printed circuit board (120). The printed circuit board assembly (100) also comprises a spacer element (130) having one or more conductor tracks (134) on a rear side of the spacer element (130) and having one or more conductor tracks (134) on a front side of the spacer element (130). The one or more conductor tracks (134) on the rear side is/are connected to the one or more conductor tracks (134) on the front side in an electrically conductive manner. Furthermore, the one or more conductor tracks (134) on the rear side is/are soldered to the one or more first contact points (111). In addition, the one or more conductor tracks (134) on the front side is/are soldered to the one or more second contact points (121).
IPC 8 full level
H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP)
H05K 1/141 (2013.01); H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 1/182 (2013.01); H05K 3/3436 (2013.01); H05K 3/3442 (2013.01); H05K 2201/042 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10477 (2013.01); H05K 2201/2018 (2013.01); H05K 2203/0465 (2013.01); H05K 2203/1572 (2013.01)
Citation (search report)
See references of WO 2018188918A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102017206099 A1 20181011; CN 110463359 A 20191115; EP 3610705 A1 20200219; WO 2018188918 A1 20181018
DOCDB simple family (application)
DE 102017206099 A 20170410; CN 201880024093 A 20180321; EP 18712599 A 20180321; EP 2018057110 W 20180321