Global Patent Index - EP 3618592 A1

EP 3618592 A1 20200304 - ELECTRONIC APPARATUS AND METHOD FOR PRODUCING ELECTRONIC APPARATUS

Title (en)

ELECTRONIC APPARATUS AND METHOD FOR PRODUCING ELECTRONIC APPARATUS

Title (de)

ELEKTRONISCHE VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN VORRICHTUNG

Title (fr)

APPAREIL ÉLECTRONIQUE ET PROCÉDÉ DE PRODUCTION DUDIT APPAREIL

Publication

EP 3618592 A1 20200304 (EN)

Application

EP 19186727 A 20190717

Priority

JP 2018162179 A 20180830

Abstract (en)

An electronic apparatus includes a housing, a first substrate, and at least one substrate module. The housing includes a bottom plate and a plurality of side plates perpendicular to the bottom plate. At least one side plate among the plurality of side plates includes a protrusion protruding toward an inside of the housing. The first substrate is parallel with the bottom plate. The at least one substrate module stands upright on the first substrate, and includes a second substrate and a substrate fixing member to which the second substrate is fixed. The substrate fixing member includes a hole engaged with the protrusion of the at least one side plate.

IPC 8 full level

H05K 7/14 (2006.01)

CPC (source: CN EP US)

G06F 1/186 (2013.01 - US); H01R 12/737 (2013.01 - US); H02M 7/003 (2013.01 - US); H05K 1/141 (2013.01 - US); H05K 3/366 (2013.01 - US); H05K 5/0008 (2013.01 - US); H05K 5/0017 (2013.01 - US); H05K 7/1417 (2013.01 - CN); H05K 7/1427 (2013.01 - US); H05K 7/14324 (2022.08 - EP); H05K 7/1454 (2013.01 - EP); H05K 7/209 (2013.01 - US); H05K 2201/044 (2013.01 - US)

Citation (applicant)

JP H09135090 A 19970520 - MITSUBISHI ELECTRIC CORP

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3618592 A1 20200304; EP 3618592 B1 20230830; CN 110876247 A 20200310; CN 110876247 B 20210101; JP 2020035936 A 20200305; JP 6644354 B1 20200212; US 10798841 B2 20201006; US 2020077532 A1 20200305

DOCDB simple family (application)

EP 19186727 A 20190717; CN 201910387688 A 20190510; JP 2018162179 A 20180830; US 201916538839 A 20190813