Global Patent Index - EP 3621416 A2

EP 3621416 A2 20200311 - TWO-STEP, DIRECT-WRITE LASER METALLIZATION

Title (en)

TWO-STEP, DIRECT-WRITE LASER METALLIZATION

Title (de)

ZWEISTUFIGE LASERMETALLISIERUNG MIT DIREKTSCHREIBVORGANG

Title (fr)

MÉTALLISATION LASER À ÉCRITURE DIRECTE EN DEUX ÉTAPES

Publication

EP 3621416 A2 20200311 (EN)

Application

EP 19195990 A 20140218

Priority

  • US 201361765808 P 20130218
  • EP 14751180 A 20140218
  • IL 2014000014 W 20140218

Abstract (en)

A method for manufacturing, comprising coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate; irradiating the coated substrate with an energy beam so as to fix a pattern (42) in an outer layer of the matrix without fixing a bulk of the matrix or sintering the material that is to be patterned in the matrix; removing the matrix (28) remaining on the substrate (22) outside the fixed pattern (42); and after removing the matrix (28), sintering the material in the pattern (42), wherein the matrix (28) comprises a photosensitive surfactant additive, and wherein irradiating the coated substrate activates the additive so as to cause the additive to form the fixed pattern (42) in the outer layer of the matrix (28).

IPC 8 full level

H05K 3/02 (2006.01); B05D 3/06 (2006.01); B05D 5/12 (2006.01); G03F 7/40 (2006.01); G03F 7/039 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/22 (2006.01)

CPC (source: CN EP US)

G03F 7/40 (2013.01 - CN EP US); H05K 3/02 (2013.01 - CN EP US); H05K 3/027 (2013.01 - EP US); H05K 3/12 (2013.01 - US); H05K 3/1291 (2013.01 - US); G03F 7/039 (2013.01 - CN EP US); H05K 1/097 (2013.01 - EP US); H05K 3/1283 (2013.01 - EP US); H05K 3/227 (2013.01 - EP US); H05K 2201/0257 (2013.01 - CN EP US); H05K 2201/2054 (2013.01 - EP US); H05K 2203/0514 (2013.01 - CN EP US); H05K 2203/107 (2013.01 - CN EP US); H05K 2203/108 (2013.01 - EP US); H05K 2203/111 (2013.01 - US); H05K 2203/1131 (2013.01 - CN EP US); H05K 2203/1194 (2013.01 - EP US); H05K 2203/1476 (2013.01 - EP US); H05K 2203/1484 (2013.01 - EP US)

Citation (applicant)

US 2008286488 A1 20081120 - LI YUNJUN [US], et al

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2014125470 A1 20140821; CN 105009695 A 20151028; CN 105009695 B 20180918; EP 2957155 A1 20151223; EP 2957155 A4 20170517; EP 2957155 B1 20190911; EP 3621416 A2 20200311; EP 3621416 A3 20200506; JP 2016516211 A 20160602; KR 102107871 B1 20200508; KR 20150118959 A 20151023; TW 201444434 A 20141116; TW I636717 B 20180921; US 10015887 B2 20180703; US 2015382476 A1 20151231

DOCDB simple family (application)

IL 2014000014 W 20140218; CN 201480009274 A 20140218; EP 14751180 A 20140218; EP 19195990 A 20140218; JP 2015557563 A 20140218; KR 20157022651 A 20140218; TW 103105324 A 20140218; US 201414766749 A 20140218