EP 3625587 A1 20200325 - ELECTRONIC ASSEMBLY
Title (en)
ELECTRONIC ASSEMBLY
Title (de)
ELEKTRONISCHE BAUEINHEIT
Title (fr)
MODULE ÉLECTRONIQUE
Publication
Application
Priority
- DE 102017208352 A 20170518
- EP 2018057867 W 20180328
Abstract (en)
[origin: WO2018210474A1] The invention relates to an electronic assembly (10), particularly a sensor device, having a housing (12) sealed against the ingress of media, having electronic components (31, 32) arranged in an interior space (14; 14a) of the housing (12) and having a filling element (35; 35a), which extends at least almost as far as the electronic components (31, 32) or is in contact therewith.
IPC 8 full level
G01S 15/931 (2020.01)
CPC (source: EP)
G01S 15/931 (2013.01); G01S 2015/937 (2013.01)
Citation (search report)
See references of WO 2018210474A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2018210474 A1 20181122; CN 110678779 A 20200110; DE 102017208352 A1 20181122; EP 3625587 A1 20200325
DOCDB simple family (application)
EP 2018057867 W 20180328; CN 201880032726 A 20180328; DE 102017208352 A 20170518; EP 18714488 A 20180328