EP 3633715 A1 20200408 - MULTI-CLIP STRUCTURE FOR DIE BONDING
Title (en)
MULTI-CLIP STRUCTURE FOR DIE BONDING
Title (de)
MEHRKLIPPSTRUKTUR FÜR DAS DIE-BONDEN
Title (fr)
STRUCTURE MULTI-AGRAFE POUR LIAISON DE PUCE
Publication
Application
Priority
EP 18198113 A 20181002
Abstract (en)
A multi-clip structure (100) includes a first clip (110) for die bonding and a second clip (120, 130) for die bonding. The multi-clip structure (100) further includes a retaining tape (150) fixed to the first clip (110) and to the second clip (120, 130) to hold the first clip (110) and the second clip (120, 130) together.
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01)
CPC (source: CN EP US)
H01L 21/50 (2013.01 - CN); H01L 21/56 (2013.01 - CN); H01L 23/3107 (2013.01 - CN); H01L 23/4334 (2013.01 - EP); H01L 23/49517 (2013.01 - CN); H01L 23/49524 (2013.01 - CN EP); H01L 23/49558 (2013.01 - EP); H01L 24/35 (2013.01 - US); H01L 24/38 (2013.01 - EP US); H01L 24/40 (2013.01 - EP US); H01L 24/41 (2013.01 - EP US); H01L 24/80 (2013.01 - CN); H01L 24/84 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP); H01L 23/49531 (2013.01 - EP); H01L 23/49555 (2013.01 - US); H01L 23/49568 (2013.01 - US); H01L 24/29 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/35 (2013.01 - EP); H01L 24/37 (2013.01 - EP); H01L 24/83 (2013.01 - EP); H01L 2224/29101 (2013.01 - EP); H01L 2224/2919 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/32245 (2013.01 - EP); H01L 2224/358 (2013.01 - US); H01L 2224/3583 (2013.01 - EP); H01L 2224/35831 (2013.01 - EP); H01L 2224/35847 (2013.01 - EP); H01L 2224/37011 (2013.01 - EP); H01L 2224/37147 (2013.01 - EP); H01L 2224/38 (2013.01 - US); H01L 2224/40105 (2013.01 - US); H01L 2224/40175 (2013.01 - US); H01L 2224/40225 (2013.01 - EP); H01L 2224/40245 (2013.01 - EP); H01L 2224/4099 (2013.01 - US); H01L 2224/40993 (2013.01 - EP); H01L 2224/4103 (2013.01 - EP); H01L 2224/41051 (2013.01 - US); H01L 2224/41175 (2013.01 - US); H01L 2224/73263 (2013.01 - EP); H01L 2224/83801 (2013.01 - EP); H01L 2224/8384 (2013.01 - EP); H01L 2224/8385 (2013.01 - EP); H01L 2224/84005 (2013.01 - EP); H01L 2224/84007 (2013.01 - US); H01L 2224/84801 (2013.01 - EP); H01L 2224/84815 (2013.01 - EP); H01L 2224/8482 (2013.01 - EP); H01L 2224/8484 (2013.01 - EP); H01L 2224/8485 (2013.01 - EP); H01L 2224/84862 (2013.01 - EP); H01L 2224/84986 (2013.01 - US); H01L 2924/10253 (2013.01 - EP); H01L 2924/10271 (2013.01 - EP); H01L 2924/10272 (2013.01 - EP); H01L 2924/10329 (2013.01 - EP); H01L 2924/1033 (2013.01 - EP); H01L 2924/10337 (2013.01 - EP); H01L 2924/10339 (2013.01 - EP); H01L 2924/10344 (2013.01 - EP); H01L 2924/12031 (2013.01 - EP); H01L 2924/12032 (2013.01 - EP); H01L 2924/13055 (2013.01 - EP); H01L 2924/13062 (2013.01 - EP); H01L 2924/13064 (2013.01 - EP); H01L 2924/13091 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/14252 (2013.01 - EP); H01L 2924/15747 (2013.01 - EP); H01L 2924/181 (2013.01 - EP)
C-Set (source: EP)
- H01L 2924/181 + H01L 2924/00012
- H01L 2224/29101 + H01L 2924/014 + H01L 2924/00014
- H01L 2224/2919 + H01L 2924/00014
- H01L 2224/84801 + H01L 2924/00014
- H01L 2224/8482 + H01L 2924/00014
- H01L 2224/8484 + H01L 2924/00014
- H01L 2224/8485 + H01L 2924/00014
- H01L 2224/84815 + H01L 2924/00014
- H01L 2224/84862 + H01L 2924/00014
- H01L 2224/37147 + H01L 2924/00014
- H01L 2224/3583 + H01L 2924/00014
- H01L 2224/35831 + H01L 2924/00014
- H01L 2224/35847 + H01L 2924/00014
- H01L 2924/15747 + H01L 2924/00014
- H01L 2224/8384 + H01L 2924/00014
- H01L 2224/83801 + H01L 2924/00014
- H01L 2224/8385 + H01L 2924/00014
Citation (search report)
- [XYI] JP 2013038359 A 20130221 - DENSO CORP
- [YA] DE 112015002815 T5 20170302 - ROHM CO LTD [JP]
- [A] CN 100418217 C 20080910 - TOSHIBA KK [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3633715 A1 20200408; CN 110993580 A 20200410; US 11189592 B2 20211130; US 2020105707 A1 20200402
DOCDB simple family (application)
EP 18198113 A 20181002; CN 201910941297 A 20190930; US 201916588127 A 20190930