EP 3635792 A1 20200415 - MULTI-LAYER METAL FILM STACKS FOR SHINGLED SILICON SOLAR CELL ARRAYS
Title (en)
MULTI-LAYER METAL FILM STACKS FOR SHINGLED SILICON SOLAR CELL ARRAYS
Title (de)
MEHRSCHICHT-METALLFILMSTAPEL FÜR SCHINDELFÖRMIGE SILIZIUMSOLARZELLENANORDNUNGEN
Title (fr)
EMPILEMENTS DE FILMS MÉTALLIQUES MULTICOUCHE POUR RÉSEAUX EN BARDEAUX DE CELLULES SOLAIRES EN SILICIUM
Publication
Application
Priority
- US 201762504532 P 20170510
- US 2018032159 W 20180510
Abstract (en)
[origin: WO2018209147A1] Shingled arrays of solar cells are disclosed. The solar cells used to form the shingled arrays are made using novel, new intercalation pastes. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to great advantage by increasing the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), passivated emitter and rear contact (PERC) photovoltaic cells.
IPC 8 full level
H01L 31/04 (2014.01); H01L 31/05 (2014.01); H01L 31/18 (2006.01); H02S 40/36 (2014.01)
CPC (source: EP KR)
H01B 1/16 (2013.01 - EP KR); H01B 1/22 (2013.01 - EP KR); H01L 31/02002 (2013.01 - KR); H01L 31/022425 (2013.01 - EP KR); H01L 31/032 (2013.01 - KR); H01L 31/049 (2014.12 - KR); H01L 31/0504 (2013.01 - EP KR); Y02E 10/50 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2018209147 A1 20181115; CN 111316449 A 20200619; EP 3635792 A1 20200415; EP 3635792 A4 20210120; JP 2020520114 A 20200702; KR 20200026189 A 20200310
DOCDB simple family (application)
US 2018032159 W 20180510; CN 201880045803 A 20180510; EP 18799289 A 20180510; JP 2019562278 A 20180510; KR 20197036327 A 20180510