Global Patent Index - EP 3640990 A4

EP 3640990 A4 20210310 - MICRO LIGHT EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR

Title (en)

MICRO LIGHT EMITTING DIODE DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR

Title (de)

MIKRO-LEUCHTDIODENANZEIGETAFEL UND HERSTELLUNGSVERFAHREN DAFÜR

Title (fr)

PANNEAU D'AFFICHAGE À MICRO-DIODES ÉLECTROLUMINESCENTES ET SON PROCÉDÉ DE FABRICATION

Publication

EP 3640990 A4 20210310 (EN)

Application

EP 17911140 A 20170620

Priority

  • CN 201710370730 A 20170523
  • CN 2017089250 W 20170620

Abstract (en)

[origin: US2018342492A1] The present invention provides a micro light emitting-diode display panel and a manufacturing method thereof. The first electrode contact and the second electrode contact are alternatively disposed on the base substrate of the micro light-emitting-diode display panel, and the first electrode contact and the second electrode contact are respectively connected with the bottom electrode and the connection electrode of the micro light-emitting-diode. The connection electrode is also connected the top electrode of the micro light-emitting-diode, and the micro light-emitting-diodes can be immediately inspected after the micro-light-emitting-diode is transferred, to reduce the difficulty of detection and product repair, and to improve the product yield.

IPC 8 full level

H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01)

CPC (source: CN EP KR US)

H01L 21/0274 (2013.01 - KR); H01L 21/6835 (2013.01 - EP KR US); H01L 22/14 (2013.01 - KR); H01L 22/20 (2013.01 - EP KR US); H01L 22/30 (2013.01 - US); H01L 25/0753 (2013.01 - EP KR US); H01L 25/167 (2013.01 - EP KR US); H01L 27/1214 (2013.01 - KR US); H01L 27/156 (2013.01 - CN KR); H01L 33/005 (2013.01 - CN); H01L 33/0093 (2020.05 - US); H01L 33/36 (2013.01 - US); H01L 33/38 (2013.01 - CN KR); H01L 33/382 (2013.01 - US); H01L 33/385 (2013.01 - US); H01L 33/44 (2013.01 - KR US); H01L 33/483 (2013.01 - KR US); H01L 33/62 (2013.01 - EP KR US); H01L 21/67144 (2013.01 - US); H01L 33/0095 (2013.01 - EP US); H01L 33/20 (2013.01 - EP US); H01L 2221/68322 (2013.01 - EP US); H01L 2221/68354 (2013.01 - EP US); H01L 2221/68368 (2013.01 - EP US); H01L 2221/68386 (2013.01 - US); H01L 2933/0016 (2013.01 - US); H01L 2933/0025 (2013.01 - US); H01L 2933/0066 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

US 10269779 B2 20190423; US 2018342492 A1 20181129; CN 107170773 A 20170915; CN 107170773 B 20190917; EP 3640990 A1 20200422; EP 3640990 A4 20210310; JP 2020521180 A 20200716; JP 6916910 B2 20210811; KR 102341625 B1 20211222; KR 20200011964 A 20200204; US 10424569 B2 20190924; US 2019189604 A1 20190620; WO 2018214199 A1 20181129

DOCDB simple family (application)

US 201715548097 A 20170620; CN 2017089250 W 20170620; CN 201710370730 A 20170523; EP 17911140 A 20170620; JP 2019565004 A 20170620; KR 20197037966 A 20170620; US 201916285122 A 20190225