Global Patent Index - EP 3656001 A1

EP 3656001 A1 20200527 - LIGHT EMITTING DEVICE INCLUDING A LEAD FRAME AND AN INSULATING MATERIAL

Title (en)

LIGHT EMITTING DEVICE INCLUDING A LEAD FRAME AND AN INSULATING MATERIAL

Title (de)

LICHTEMITTIERENDE VORRICHTUNG MIT LEITERRAHMEN UND ISOLIERENDEM MATERIAL

Title (fr)

DISPOSITIF ÉLECTROLUMINESCENT COMPRENANT UNE GRILLE DE CONNEXION ET UN MATÉRIAU ISOLANT

Publication

EP 3656001 A1 20200527 (EN)

Application

EP 18747087 A 20180712

Priority

  • US 201715652603 A 20170718
  • EP 17184498 A 20170802
  • US 2018041774 W 20180712

Abstract (en)

[origin: WO2019018193A1] A package for a light emitting diode (LED) may include a lead frame, an LED, and an optically reflective but electrically non-conductive molding. The lead frame may have a first lead frame part and a second lead frame part electrically isolated from the first lead frame part. Each lead frame part may have at least one raised pillar. The molding may be disposed over the lead frame except over the pillars of the lead frame. The LED may be mounted on at least one pillar and is electrically coupled to at least one pillar. The molding may serve the purpose of a highly reflective, electrically conductive material like silver without being subject to tarnishing.

IPC 8 full level

H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01)

CPC (source: EP KR)

H01L 23/485 (2013.01 - KR); H01L 23/49541 (2013.01 - KR); H01L 33/486 (2013.01 - KR); H01L 33/54 (2013.01 - KR); H01L 33/60 (2013.01 - KR); H01L 33/62 (2013.01 - EP KR); H01L 33/486 (2013.01 - EP); H01L 33/60 (2013.01 - EP); H01L 2224/16245 (2013.01 - EP); H01L 2224/32245 (2013.01 - EP); H01L 2224/48247 (2013.01 - EP); H01L 2224/48257 (2013.01 - EP); H01L 2224/48464 (2013.01 - EP); H01L 2224/73265 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H01L 2933/0033 (2013.01 - EP KR); H01L 2933/0066 (2013.01 - EP KR)

C-Set (source: EP)

  1. H01L 2924/181 + H01L 2924/00012
  2. H01L 2224/73265 + H01L 2224/32245 + H01L 2224/48247 + H01L 2924/00
  3. H01L 2224/73265 + H01L 2224/32245 + H01L 2224/48257 + H01L 2924/00

Citation (search report)

  • [PX] WO 2018081263 A1 20180503 - DU PONT [US]
  • [XIY] US 3830762 A 19740820 - ABBOTT T
  • [XY] WO 2016106068 A1 20160630 - DU PONT [US]
  • [Y] US 2016362525 A1 20161215 - TEASLEY MARK F [US], et al
  • [Y] US 2010022684 A1 20100128 - WALLEN PETER J [US], et al
  • [XI] US 2013343067 A1 20131226 - OKADA SATOSHI [JP]
  • [XI] US 2013343067 A1 20131226 - OKADA SATOSHI [JP]
  • [Y] CHOI SUNG-SEEN ET AL: "Influence of silane coupling agent on bound rubber formation of NR/SBR blend compounds reinforced with carbon black", POLYMER BULLETIN, SPRINGER, HEIDELBERG, DE, vol. 73, no. 12, 13 April 2016 (2016-04-13), pages 3453 - 3464, XP036073901, ISSN: 0170-0839, [retrieved on 20160413], DOI: 10.1007/S00289-016-1666-7
  • [Y] SUNG-SEEN CHOI ET AL: "Influence of Coupling Agent on Properties of Carbon Black-Reinforced SBR and NR/SBR Vulcanizates", JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, vol. 13, no. 6, 1 November 2007 (2007-11-01), pages 1017 - 1022, XP055507253
  • See also references of WO 2019018193A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2019018193 A1 20190124; CN 111357124 A 20200630; EP 3656001 A1 20200527; JP 2020527864 A 20200910; JP 2023090921 A 20230629; KR 102408302 B1 20220614; KR 20200033889 A 20200330; TW 201916413 A 20190416; TW I832819 B 20240221

DOCDB simple family (application)

US 2018041774 W 20180712; CN 201880060567 A 20180712; EP 18747087 A 20180712; JP 2020502262 A 20180712; JP 2023077765 A 20230510; KR 20207004530 A 20180712; TW 107124773 A 20180718