EP 3660027 A4 20210428 - THERMOSETTING RESIN COMPOSITION, PREPREG MADE THEREFROM, LAMINATE CLAD WITH METAL FOIL, AND HIGH-FREQUENCY CIRCUIT BOARD
Title (en)
THERMOSETTING RESIN COMPOSITION, PREPREG MADE THEREFROM, LAMINATE CLAD WITH METAL FOIL, AND HIGH-FREQUENCY CIRCUIT BOARD
Title (de)
WÄRMEHÄRTENDE HARZZUSAMMENSETZUNG, DARAUS HERGESTELLTES PREPREG, LAMINAT MIT METALLFOLIENKASCHIERUNG UND HOCHFREQUENZLEITERPLATTE
Title (fr)
COMPOSITION DE RÉSINE THERMODURCISSABLE, PRÉIMPRÉGNÉ FABRIQUÉ À PARTIR DE CELLE-CI, STRATIFIÉ REVÊTU DE FEUILLE MÉTALLIQUE, ET CARTE DE CIRCUIT IMPRIMÉ HAUTE FRÉQUENCE
Publication
Application
Priority
- CN 201710618289 A 20170726
- CN 2017109050 W 20171102
Abstract (en)
[origin: EP3660027A1] Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.
IPC 8 full level
C07F 9/6574 (2006.01); C08F 8/40 (2006.01); C08F 283/06 (2006.01); C08F 290/06 (2006.01); C08F 290/14 (2006.01); C08F 297/02 (2006.01); C08F 299/02 (2006.01); C08J 5/24 (2006.01); C08L 71/12 (2006.01); H05K 1/03 (2006.01)
CPC (source: CN EP KR US)
B32B 15/08 (2013.01 - CN EP KR US); B32B 15/14 (2013.01 - KR); B32B 27/04 (2013.01 - EP); B32B 27/28 (2013.01 - EP KR); B32B 27/285 (2013.01 - CN US); C07F 9/657172 (2013.01 - KR); C07F 9/6574 (2013.01 - EP KR); C08F 230/02 (2013.01 - KR); C08F 283/06 (2013.01 - KR); C08F 290/062 (2013.01 - EP); C08F 290/14 (2013.01 - EP); C08F 299/022 (2013.01 - EP); C08G 8/30 (2013.01 - CN EP KR); C08G 8/36 (2013.01 - CN EP KR); C08G 79/04 (2013.01 - US); C08J 5/04 (2013.01 - EP KR); C08J 5/043 (2013.01 - CN); C08J 5/10 (2013.01 - CN EP); C08J 5/24 (2013.01 - KR); C08J 5/244 (2021.05 - CN EP US); C08K 3/36 (2013.01 - CN EP KR); C08K 5/5313 (2013.01 - CN EP KR US); C08K 7/14 (2013.01 - CN EP KR); C08L 43/02 (2013.01 - US); C08L 61/14 (2013.01 - EP KR); C08L 71/12 (2013.01 - CN EP); C08L 71/126 (2013.01 - KR US); H05K 1/03 (2013.01 - EP); H05K 1/0353 (2013.01 - CN); H05K 1/0366 (2013.01 - KR); B32B 2260/021 (2013.01 - CN KR); B32B 2260/046 (2013.01 - CN KR US); B32B 2262/00 (2013.01 - KR); B32B 2262/101 (2013.01 - CN); B32B 2457/08 (2013.01 - KR US); C08F 8/40 (2013.01 - EP); C08J 5/043 (2013.01 - US); C08J 2371/12 (2013.01 - CN US); C08L 2201/02 (2013.01 - CN US); C08L 2201/08 (2013.01 - CN); C08L 2203/20 (2013.01 - CN US)
C-Set (source: CN EP)
CN
- C08K 5/5313 + C08L 71/126
- C08K 3/36 + C08L 71/126
- C08K 7/14 + C08L 71/126
- C08L 71/12 + C08L 61/14 + C08K 5/5313 + C08K 7/14
EP
Citation (search report)
[X] US 2015166788 A1 20150618 - LI CHANGYUAN [CN], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3660027 A1 20200603; EP 3660027 A4 20210428; CN 109306171 A 20190205; CN 109306171 B 20210101; JP 2020519707 A 20200702; JP 6846540 B2 20210324; KR 102282601 B1 20210729; KR 20200021078 A 20200227; TW 201910427 A 20190316; TW I658095 B 20190501; US 11377551 B2 20220705; US 2020224026 A1 20200716; WO 2019019464 A1 20190131
DOCDB simple family (application)
EP 17919289 A 20171102; CN 201710618289 A 20170726; CN 2017109050 W 20171102; JP 2019557861 A 20171102; KR 20207001409 A 20171102; TW 106140389 A 20171121; US 201716633018 A 20171102