EP 3660068 A1 20200603 - EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE COMPRISING SAME
Title (en)
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE COMPRISING SAME
Title (de)
EPOXIDHARZZUSAMMENSETZUNG UND HALBLEITERBAUELEMENT DAMIT
Title (fr)
COMPOSITION DE RÉSINE ÉPOXY ET DISPOSITIF SEMI-CONDUCTEUR LA COMPRENANT
Publication
Application
Priority
- KR 20170095287 A 20170727
- KR 2018007381 W 20180629
Abstract (en)
The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion promotor, the adhesion promotor comprising an imidazole-based compound having an average particle size of 0.1-5 µm, and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion to a different kind of material, such as copper, nickel, or silver, and thus, may satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.
IPC 8 full level
C08G 59/02 (2006.01); C08G 59/62 (2006.01); C08K 3/017 (2018.01); C08K 5/14 (2006.01); C08K 5/3445 (2006.01); C08K 5/3492 (2006.01); C08K 5/5313 (2006.01); C08K 5/5415 (2006.01); H01L 23/29 (2006.01)
CPC (source: EP KR US)
C08G 59/02 (2013.01 - EP KR); C08G 59/621 (2013.01 - EP KR); C08K 3/017 (2017.12 - EP KR); C08K 3/36 (2013.01 - US); C08K 5/14 (2013.01 - EP KR); C08K 5/3445 (2013.01 - EP KR); C08K 5/34922 (2013.01 - EP KR); C08K 5/34926 (2013.01 - US); C08K 5/5313 (2013.01 - EP KR); C08K 5/5415 (2013.01 - EP KR); C08K 5/5419 (2013.01 - US); C08L 63/00 (2013.01 - EP); H01L 23/295 (2013.01 - EP KR US); C08K 2201/005 (2013.01 - EP KR)
C-Set (source: EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3660068 A1 20200603; EP 3660068 A4 20210120; CN 110719925 A 20200121; JP 2020524198 A 20200813; KR 101927631 B1 20181210; US 2020165414 A1 20200528; WO 2019022390 A1 20190131
DOCDB simple family (application)
EP 18837842 A 20180629; CN 201880038211 A 20180629; JP 2019569813 A 20180629; KR 20170095287 A 20170727; KR 2018007381 W 20180629; US 201816627315 A 20180629