EP 3664958 A4 20210825 - LEADLESS STACK COMPRISING MULTIPLE COMPONENTS
Title (en)
LEADLESS STACK COMPRISING MULTIPLE COMPONENTS
Title (de)
LEITUNGSLOSER STAPEL MIT MEHREREN KOMPONENTEN
Title (fr)
PILE SANS FIL COMPRENANT DE MULTIPLES COMPOSANTS
Publication
Application
Priority
- US 201715670247 A 20170807
- US 2018043649 W 20180725
Abstract (en)
[origin: WO2019032294A1] An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements.
IPC 8 full level
H01G 4/38 (2006.01); B22F 1/107 (2022.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/40 (2006.01)
CPC (source: EP US)
B22F 1/107 (2022.01 - EP US); B22F 7/064 (2013.01 - EP); B23K 35/262 (2013.01 - EP US); B32B 37/1207 (2013.01 - EP); H01G 4/232 (2013.01 - EP); H01G 4/2325 (2013.01 - EP); H01G 4/30 (2013.01 - EP); B23K 35/025 (2013.01 - EP); B23K 35/3006 (2013.01 - EP); B23K 35/302 (2013.01 - EP); B23K 35/36 (2013.01 - EP); B23K 35/3613 (2013.01 - EP); B32B 2037/1215 (2013.01 - EP)
Citation (search report)
- [X] US 2017025223 A1 20170126 - BULTITUDE JOHN [US], et al
- [X] WO 2014081666 A1 20140530 - KEMET ELECTRONICS CORP [US]
- [A] US 5038996 A 19910813 - WILCOX JAMES R [US], et al
- [A] US 2016118190 A1 20160428 - PARK HEUNG KIL [KR], et al
- See references of WO 2019032294A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2019032294 A1 20190214; CN 110997223 A 20200410; EP 3664958 A1 20200617; EP 3664958 A4 20210825; JP 2020530656 A 20201022; JP 2022068307 A 20220509; JP 7334285 B2 20230828
DOCDB simple family (application)
US 2018043649 W 20180725; CN 201880051625 A 20180725; EP 18844928 A 20180725; JP 2020506336 A 20180725; JP 2022024677 A 20220221