EP 3675357 B1 20220824 - ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF
Title (en)
ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF
Title (de)
AKUSTISCHE WELLENVORRICHTUNG UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
DISPOSITIF À ONDES ACOUSTIQUES ET SON PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- CN 201811291555 A 20181031
- CN 2019093405 W 20190627
Abstract (en)
[origin: EP3675357A1] An acoustic wave device is provided, which includes a substrate, as well as a first electrode layer, a piezoelectric layer and a second electrode layer which are sequentially arranged on the substrate. The device further includes a protective layer. The protective layer is at least arranged at a first position above the surface, far away from the substrate, of the second electrode layer. The first position is a position, corresponding to a first overlapping region, above the second electrode layer. The first overlapping region, where an active area of the acoustic wave device is located, is at least a part of a region where the first electrode layer, the second electrode layer and the piezoelectric layer are overlapped. A fabrication method for an acoustic wave device is also provided.
IPC 8 full level
H03H 3/02 (2006.01); H03H 3/04 (2006.01); H03H 9/10 (2006.01); H03H 9/17 (2006.01)
CPC (source: CN EP KR US)
H03H 3/02 (2013.01 - CN KR); H03H 3/04 (2013.01 - EP US); H03H 9/1014 (2013.01 - EP); H03H 9/1042 (2013.01 - EP); H03H 9/105 (2013.01 - EP US); H03H 9/131 (2013.01 - US); H03H 9/15 (2013.01 - CN); H03H 9/171 (2013.01 - KR); H03H 9/173 (2013.01 - EP); H03H 9/54 (2013.01 - KR); H03H 2003/021 (2013.01 - EP US); H03H 2003/0414 (2013.01 - EP)
Citation (examination)
US 2002109565 A1 20020815 - ELLA JUHA [FI], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3675357 A1 20200701; EP 3675357 A4 20201223; EP 3675357 B1 20220824; CN 109474254 A 20190315; CN 109474254 B 20201208; JP 2021503725 A 20210212; JP 7445957 B2 20240308; KR 102299759 B1 20210907; KR 20200051527 A 20200513; US 11362633 B2 20220614; US 2021359658 A1 20211118; WO 2020087957 A1 20200507
DOCDB simple family (application)
EP 19816487 A 20190627; CN 201811291555 A 20181031; CN 2019093405 W 20190627; JP 2019569965 A 20190627; KR 20197037293 A 20190627; US 201916627290 A 20190627