Global Patent Index - EP 3679599 A4

EP 3679599 A4 20210526 - HIGH DENSITY MULTI-COMPONENT AND SERIAL PACKAGES

Title (en)

HIGH DENSITY MULTI-COMPONENT AND SERIAL PACKAGES

Title (de)

HOCHDICHTE MEHRKOMPONENTEN- UND SERIENVERPACKUNGEN

Title (fr)

BOÎTIERS MULTI-COMPOSANTS DE HAUTE DENSITÉ EN SÉRIE

Publication

EP 3679599 A4 20210526 (EN)

Application

EP 18853638 A 20180910

Priority

  • US 201715699654 A 20170908
  • US 201715804515 A 20171106
  • US 201715852799 A 20171222
  • US 2018050142 W 20180910

Abstract (en)

[origin: WO2019051346A1] An improved high density multi-component package is provided. The package comprising at least two electronic components. Each electronic component comprises a first external termination and a second external termination. At least one electrical connection is between adjacent first external terminations of adjacent electronic components. At least one mechanical connection is between adjacent electronic components. At least two adjacent electronic components are connected serially.

IPC 8 full level

H01L 21/822 (2006.01); H01G 2/06 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01L 21/8224 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01)

CPC (source: EP)

H01G 2/06 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01L 23/642 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/50 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/10 (2013.01); H01L 25/16 (2013.01); H05K 1/141 (2013.01); H05K 1/147 (2013.01); H05K 1/181 (2013.01); H01L 24/29 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/14517 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/16267 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/17183 (2013.01); H01L 2224/29021 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32106 (2013.01); H01L 2224/32147 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/32268 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48477 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/8184 (2013.01); H01L 2224/81895 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/83877 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/15159 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10636 (2013.01)

C-Set (source: EP)

  1. H01L 2224/81825 + H01L 2924/00014
  2. H01L 2224/8184 + H01L 2924/00014
  3. H01L 2224/81895 + H01L 2924/00014
  4. H01L 2224/1329 + H01L 2924/00014
  5. H01L 2224/133 + H01L 2924/014
  6. H01L 2224/73203 + H01L 2924/00012
  7. H01L 2224/83862 + H01L 2924/00014
  8. H01L 2224/83874 + H01L 2924/00014
  9. H01L 2224/83877 + H01L 2924/00014
  10. H01L 2224/8385 + H01L 2924/0782
  11. H01L 2224/16225 + H01L 2924/00012
  12. H01L 2224/131 + H01L 2924/014
  13. H01L 2924/00014 + H01L 2224/45099

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2019051346 A1 20190314; CN 111052347 A 20200421; CN 111052347 B 20240301; EP 3679599 A1 20200715; EP 3679599 A4 20210526; JP 2020534675 A 20201126; JP 7121797 B2 20220818

DOCDB simple family (application)

US 2018050142 W 20180910; CN 201880051521 A 20180910; EP 18853638 A 20180910; JP 2020513548 A 20180910