EP 3686319 A1 20200729 - INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING INDIUM ON NICKEL
Title (en)
INDIUM ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING INDIUM ON NICKEL
Title (de)
INDIUM-ELEKTROPLATTIERUNGSZUSAMMENSETZUNGEN UND INDIUM-ELEKTROPLATTIERUNGSVERFAHREN AUF NICKEL
Title (fr)
COMPOSITIONS ET PROCÉDÉS D'ÉLECTRODÉPOSITION D'INDIUM SUR DU NICKEL
Publication
Application
Priority
US 201916257132 A 20190125
Abstract (en)
Indium electroplating compositions electroplate substantially defect-free, whisker-free, uniform indium layers which have a smooth surface morphology on nickel. The indium electroplating compositions are environmentally friendly and include select amino acids to provide for the smooth, uniform and defect-free indium deposits.
IPC 8 full level
C25D 3/54 (2006.01); C25D 3/56 (2006.01); C25D 5/12 (2006.01); C25D 5/50 (2006.01)
CPC (source: CN EP KR US)
C25D 3/54 (2013.01 - CN EP KR US); C25D 3/56 (2013.01 - EP KR US); C25D 5/12 (2013.01 - EP KR US); C25D 5/50 (2013.01 - EP); C25D 5/611 (2020.08 - EP KR US); C25D 5/627 (2020.08 - EP KR US); C25D 5/50 (2013.01 - KR)
Citation (search report)
- [A] US 2018298511 A1 20181018 - VAZHENIN GRIGORY [DE], et al
- [A] US 9809892 B1 20171107 - QIN YI [US], et al
- [A] US 2018016689 A1 20180118 - QIN YI [US], et al
- [A] US 1935630 A 19331121 - DANIEL GRAY
- [XAI] T. S. DOBROVOLSKA ET AL: "Electrodeposition of gold-indium alloys", TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING., vol. 93, no. 6, 2 November 2015 (2015-11-02), GB, pages 321 - 325, XP055704843, ISSN: 0020-2967, DOI: 10.1080/00202967.2015.1117260
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3686319 A1 20200729; CN 111485262 A 20200804; JP 2020117803 A 20200806; KR 20200092882 A 20200804; TW 202028541 A 20200801; US 2020240029 A1 20200730
DOCDB simple family (application)
EP 20153749 A 20200124; CN 202010056803 A 20200117; JP 2020006900 A 20200120; KR 20200007127 A 20200120; TW 109101639 A 20200117; US 201916257132 A 20190125