EP 3693495 A1 20200812 - ELECTROLESS PALLADIUM PLATING SOLUTION, AND ELECTROLESS PALLADIUM PLATED COATING
Title (en)
ELECTROLESS PALLADIUM PLATING SOLUTION, AND ELECTROLESS PALLADIUM PLATED COATING
Title (de)
LÖSUNG ZUR STROMLOSEN ABSCHEIDUNG VON PALLADIUM UND BESCHICHTUNG MIT STROMLOSER PALLADIUMABSCHEIDUNG
Title (fr)
SOLUTION DE DÉPOSITION AUTOCATALYTIQUE DE PALLADIUM, ET FILM DE REVÊTEMENT DE DÉPOSITION AUTOCATALYTIQUE DE PALLADIUM
Publication
Application
Priority
- JP 2017195651 A 20171006
- JP 2018036970 W 20181003
Abstract (en)
An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention solved above problems, the solution includes a Palladium compound, at least one selected from a group consisting of a hypophosphorous acid compound and a phosphorous acid compound, at least one selected from the group consisting of an amine borane compound and a hydroboron compound, and a complexing agent.
IPC 8 full level
C23C 18/44 (2006.01)
CPC (source: EP KR US)
C23C 18/1651 (2013.01 - EP US); C23C 18/44 (2013.01 - EP KR US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3693495 A1 20200812; EP 3693495 A4 20210929; CN 111164236 A 20200515; JP 2019070172 A 20190509; JP 7149061 B2 20221006; KR 20200062265 A 20200603; TW 201925531 A 20190701; TW I829653 B 20240121; US 2020248312 A1 20200806; WO 2019069964 A1 20190411
DOCDB simple family (application)
EP 18864662 A 20181003; CN 201880064756 A 20181003; JP 2017195651 A 20171006; JP 2018036970 W 20181003; KR 20207011967 A 20181003; TW 107135158 A 20181005; US 201816753417 A 20181003