EP 3695692 A1 20200819 - METHOD FOR MECHANICAL CONTACTING OF A POTTING FRAME ON A PRINTED CIRCUIT BOARD
Title (en)
METHOD FOR MECHANICAL CONTACTING OF A POTTING FRAME ON A PRINTED CIRCUIT BOARD
Title (de)
VERFAHREN ZUR MECHANISCHEN KONTAKTIERUNG EINES VERGUSSRAHMENS AUF EINER LEITERPLATTE
Title (fr)
PROCÉDÉ POUR LA MISE EN CONTACT MÉCANIQUE D'UN CADRE D'ENROBAGE SUR UNE CARTE DE CIRCUIT IMPRIMÉ
Publication
Application
Priority
- DE 102017123530 A 20171010
- EP 2018074489 W 20180911
Abstract (en)
[origin: WO2019072475A1] The invention relates to a method for mechanical contacting in particular of a potting frame (1) on a printed circuit board (20) of an electronic assembly (2). To this purpose, the potting frame (1) has at least one metallic contact surface (11); the printed circuit board (20) has a base surface (21) which is metallically structured so as to correspond to the contact surface (11). The method comprises the following method steps: positioning the mechanical component (1) with the contact surface (11) oriented towards the corresponding base surface (21), and soldering the mechanical component (1) to the circuit board (20) via the contact surface (11) and the base surface (21). The method according to the invention thus firstly has the advantage that material-saving encapsulation can be provided for electronic assemblies (2) in potentially explosive atmospheres. At the same time, it is possible to dispense with an additional process step for mechanically contacting the encapsulation on the circuit board (20) because mechanical contacting of the potting frame (1) can be completed in a process step together with the soldering of the further electrical components (3) on the circuit board (20).
IPC 8 full level
CPC (source: EP US)
H01L 21/50 (2013.01 - EP); H01L 23/04 (2013.01 - EP); H05K 1/181 (2013.01 - US); H05K 3/284 (2013.01 - EP US); H05K 3/3431 (2013.01 - US); H01L 2224/16227 (2013.01 - EP); H01L 2224/81815 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H05K 3/303 (2013.01 - EP); H05K 3/341 (2013.01 - EP); H05K 2201/10257 (2013.01 - EP); H05K 2201/10371 (2013.01 - EP); H05K 2201/10606 (2013.01 - EP); H05K 2201/2018 (2013.01 - EP); H05K 2203/043 (2013.01 - EP); H05K 2203/1316 (2013.01 - EP US); H05K 2203/1327 (2013.01 - EP US)
Citation (search report)
See references of WO 2019072475A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102017123530 A1 20190411; CN 111247878 A 20200605; EP 3695692 A1 20200819; US 11277920 B2 20220315; US 2020245470 A1 20200730; WO 2019072475 A1 20190418
DOCDB simple family (application)
DE 102017123530 A 20171010; CN 201880065121 A 20180911; EP 18772773 A 20180911; EP 2018074489 W 20180911; US 201816755112 A 20180911