Global Patent Index - EP 3701182 A1

EP 3701182 A1 20200902 - SOURCE SENSITIVE OPTIC WITH RECONFIGURABLE CHIP-ON-BOARD LIGHT EMITTING DIODE ARRAY

Title (en)

SOURCE SENSITIVE OPTIC WITH RECONFIGURABLE CHIP-ON-BOARD LIGHT EMITTING DIODE ARRAY

Title (de)

QUELLENEMPFINDLICHE OPTIK MIT REKONFIGURIERBAREN CHIP-ON-BOARD-VOLLFARBENLEUCHTDIODEN

Title (fr)

OPTIQUE SENSIBLE À LA SOURCE AVEC RÉSEAU DE DIODES ÉLECTROLUMINESCENTES À PUCE SUR PLAQUE RECONFIGURABLE

Publication

EP 3701182 A1 20200902 (EN)

Application

EP 18799653 A 20181025

Priority

  • US 201715793655 A 20171025
  • EP 18154179 A 20180130
  • US 2018057477 W 20181025

Abstract (en)

[origin: WO2019084247A1] Described herein is source sensitive optic that uses reconfigurable chip-on-board (CoB) light emitting diode (LED) arrays as light sources. In an implementation, the reconfigurable CoB LED array includes a predetermined number of LEDs that are configurable for a variety of illumination scenarios. In an implementation, the reconfigurable CoB LED array is multiple CoB LED arrays that are configured for use with the source sensitive optic as described herein. The source sensitive optic includes surface shapes that are responsive to the reconfigurable CoB LED array. The source sensitive optic is configured to provide beam profile and radiation pattern differentiation based on a CoB LED array configuration configured from the reconfigurable CoB LED. Each configurable CoB LED array configuration radiates a different beam pattern via the surface shapes due to proximity and surface shape geometries.

IPC 8 full level

F21V 5/08 (2006.01); F21K 9/60 (2016.01); F21W 131/10 (2006.01); F21W 131/103 (2006.01)

CPC (source: EP KR)

F21K 9/60 (2016.08 - EP KR); F21W 2131/103 (2013.01 - EP KR); F21Y 2105/10 (2016.08 - EP KR)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2019084247 A1 20190502; CN 111512088 A 20200807; EP 3701182 A1 20200902; JP 2021501443 A 20210114; KR 102405185 B1 20220607; KR 20200087777 A 20200721; TW 201930779 A 20190801; TW I761618 B 20220421

DOCDB simple family (application)

US 2018057477 W 20181025; CN 201880083988 A 20181025; EP 18799653 A 20181025; JP 2020523447 A 20181025; KR 20207014917 A 20181025; TW 107137799 A 20181025