EP 3701774 A1 20200902 - METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD PROVIDED WITH AT LEAST ONE COATING, AND COATING HEAD FOR CARRYING OUT THE METHOD
Title (en)
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD PROVIDED WITH AT LEAST ONE COATING, AND COATING HEAD FOR CARRYING OUT THE METHOD
Title (de)
VERFAHREN ZUM HERSTELLEN EINER MIT MINDESTENS EINER LACKIERUNG VERSEHENEN LEITERPLATTE UND LACKIERKOPF ZUR DURCHFÜHRUNG DES VERFAHRENS
Title (fr)
PROCÉDÉ DE FABRICATION D'UNE CARTE DE CIRCUIT IMPRIMÉ POURVUE D'AU MOINS UNE COUCHE DE VERNIS, ET TÊTE DE VERNISSAGE POUR LA MISE EN UVRE DU PROCÉDÉ
Publication
Application
Priority
- DE 102017124665 A 20171023
- EP 2018076292 W 20180927
Abstract (en)
[origin: WO2019081154A1] The invention discloses a method for producing a printed circuit board provided with at least one coating, the method comprising at least the following steps: mixing at least one first component with a second component of an at least two-component coating system to form a coating mixture by means of a dynamic mixer and/or by means of a static-dynamic mixer (120); feeding the coating mixture to a dispensing unit (140); and coating the printed circuit board by dispensing the coating mixture by means of the dispensing unit onto the printed circuit board. During the coating, the dispensing unit (140) is automatically moved relative to the printed circuit board in at least one dimension, in particular in two or three dimensions, and the mixer (120) is connected to the dispensing unit in such a way that the mixer is moved relative to the printed circuit board together with the dispensing unit (140). The invention further discloses to a coating head (100) for carrying out the method.
IPC 8 full level
H05K 3/00 (2006.01); B05B 13/04 (2006.01); B05C 17/005 (2006.01); H05K 3/28 (2006.01)
CPC (source: EP US)
B01F 23/43 (2022.01 - EP US); B01F 27/1143 (2022.01 - EP US); B01F 27/92 (2022.01 - EP US); B05B 1/044 (2013.01 - US); B05B 7/0408 (2013.01 - US); B05C 9/10 (2013.01 - US); B05C 11/10 (2013.01 - US); H05K 3/0091 (2013.01 - EP US); H05K 3/284 (2013.01 - EP US); B01F 2101/2305 (2022.01 - EP US); B01F 2215/0477 (2013.01 - US); B01F 2215/0481 (2013.01 - EP US); B05B 1/044 (2013.01 - EP); B05B 7/0408 (2013.01 - EP); B05B 13/041 (2013.01 - EP); B05C 17/00566 (2013.01 - EP); H05K 2201/09872 (2013.01 - EP); H05K 2201/0989 (2013.01 - EP); H05K 2203/0126 (2013.01 - EP US); H05K 2203/1366 (2013.01 - EP US); H05K 2203/1509 (2013.01 - EP)
Citation (search report)
See references of WO 2019081154A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102017124665 A1 20190425; EP 3701774 A1 20200902; US 2021178419 A1 20210617; WO 2019081154 A1 20190502
DOCDB simple family (application)
DE 102017124665 A 20171023; EP 18782366 A 20180927; EP 2018076292 W 20180927; US 201816758786 A 20180927