EP 3701775 A4 20210818 - METHOD OF BONDING INTEGRATED CIRCUIT CHIP TO DISPLAY PANEL, AND DISPLAY APPARATUS
Title (en)
METHOD OF BONDING INTEGRATED CIRCUIT CHIP TO DISPLAY PANEL, AND DISPLAY APPARATUS
Title (de)
VERFAHREN ZUM VERBINDEN EINES INTEGRIERTEN SCHALTUNGSCHIPS MIT EINER ANZEIGETAFEL UND ANZEIGEVORRICHTUNG
Title (fr)
PROCÉDÉ DE LIAISON DE PUCE DE CIRCUIT INTÉGRÉ À UN PANNEAU D'AFFICHAGE, ET APPAREIL D'AFFICHAGE
Publication
Application
Priority
- CN 201711057011 A 20171027
- CN 2018110229 W 20181015
Abstract (en)
[origin: WO2019080736A1] A method of bonding an integrated circuit chip (7) to a display panel (1) is provided. The method includes forming a plurality of first bonding pads (2) in a bonding region on a first side of the display panel (1); forming a plurality of vias (5) extending through the display panel (1) in the bonding region; subsequent to forming the plurality of vias (5), disposing an integrated circuit chip (7) having a plurality of second bonding pads (8) on a second side of the display panel (1) substantially opposite to the first side, the plurality of second bonding pads (8) being on a side of the integrated circuit chip (7) proximal to the display panel (1); and electrically connecting the plurality of first bonding pads (2) respectively with the plurality of second bonding pads (8) by forming a plurality of connectors (9) respectively in the plurality of vias (5).
IPC 8 full level
H05K 3/32 (2006.01)
CPC (source: EP US)
G02F 1/13452 (2013.01 - US); H01L 24/02 (2013.01 - US); H01L 24/08 (2013.01 - US); H01L 25/0657 (2013.01 - US); H01L 25/18 (2013.01 - US); H01L 25/50 (2013.01 - US); H05K 1/181 (2013.01 - EP); H10K 59/131 (2023.02 - US); H01L 2224/02311 (2013.01 - US); H01L 2224/02371 (2013.01 - US); H01L 2224/02372 (2013.01 - US); H01L 2224/02381 (2013.01 - US); H01L 2224/081 (2013.01 - US); H01L 2225/06544 (2013.01 - US); H05K 1/112 (2013.01 - EP); H05K 2201/09972 (2013.01 - EP); H05K 2201/10128 (2013.01 - EP); Y02P 70/50 (2015.11 - EP)
Citation (search report)
- [IY] CN 106973520 A 20170721 - BOE TECHNOLOGY GROUP CO LTD, et al
- [Y] US 2017171990 A1 20170615 - KIM BYOUNGYONG [KR], et al
- [A] US 2017170255 A1 20170615 - HA SEUNGHWA [KR], et al
- See references of WO 2019080736A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2019080736 A1 20190502; CN 109727534 A 20190507; EP 3701775 A1 20200902; EP 3701775 A4 20210818; US 11367698 B2 20220621; US 2021384149 A1 20211209
DOCDB simple family (application)
CN 2018110229 W 20181015; CN 201711057011 A 20171027; EP 18852765 A 20181015; US 201816332291 A 20181015