EP 3703127 B1 20220608 - ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Title (en)
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Title (de)
ELEKTRONISCHE VORRICHTUNG UND HERSTELLUNGSVERFAHREN EINER ELEKTRONISCHEN VORRICHTUNG
Title (fr)
DISPOSITIF ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION ASSOCIÉ
Publication
Application
Priority
KR 20190023758 A 20190228
Abstract (en)
[origin: EP3703127A1] Provided is a manufacturing method of an electronic device, including forming a circuit layer on a base layer, disposing a light emitting element for attachment over the circuit layer, disposing an insulating layer between the light emitting element and the circuit layer, and drying the insulation layer to attach the light emitting element with the insulating layer and the circuit layer.
IPC 8 full level
H01L 25/16 (2006.01); H01L 21/683 (2006.01); H01L 33/36 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01)
CPC (source: CN EP KR US)
H01L 21/6835 (2013.01 - US); H01L 21/6836 (2013.01 - EP); H01L 25/167 (2013.01 - EP); H01L 27/1214 (2013.01 - KR); H01L 27/124 (2013.01 - US); H01L 27/1248 (2013.01 - US); H01L 27/1259 (2013.01 - US); H01L 27/156 (2013.01 - CN KR); H01L 33/005 (2013.01 - KR); H01L 33/36 (2013.01 - KR); H01L 33/44 (2013.01 - KR); H01L 33/486 (2013.01 - CN); H01L 33/54 (2013.01 - KR); H01L 33/62 (2013.01 - CN KR); H01L 33/64 (2013.01 - KR); H01L 33/642 (2013.01 - CN); H01L 33/54 (2013.01 - EP); H01L 33/62 (2013.01 - EP); H01L 33/644 (2013.01 - EP); H01L 2221/68354 (2013.01 - EP); H01L 2221/68363 (2013.01 - EP); H01L 2933/0033 (2013.01 - CN); H01L 2933/005 (2013.01 - EP); H01L 2933/0066 (2013.01 - CN EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3703127 A1 20200902; EP 3703127 B1 20220608; CN 111628069 A 20200904; KR 20200105568 A 20200908; US 2020279870 A1 20200903
DOCDB simple family (application)
EP 20158479 A 20200220; CN 202010110834 A 20200224; KR 20190023758 A 20190228; US 202016797736 A 20200221