EP 3708319 A1 20200916 - BAMBOO STRIP SUBSTRATE BOARD AND PREPARATION METHOD THEREOF, BAMBOO STRIP FLOOR AND APPLICATION THEREOF
Title (en)
BAMBOO STRIP SUBSTRATE BOARD AND PREPARATION METHOD THEREOF, BAMBOO STRIP FLOOR AND APPLICATION THEREOF
Title (de)
BAMBUSSTREIFENSUBSTRATPLATTE UND HERSTELLUNGSVERFAHREN DAFÜR, BAMBUSSTREIFENBODEN UND ANWENDUNG DAVON
Title (fr)
PANNEAU DE SUBSTRAT À BANDE DE BAMBOU ET SON PROCÉDÉ DE PRÉPARATION, PLANCHER À BANDE DE BAMBOU ET SON APPLICATION
Publication
Application
Priority
CN 201910194060 A 20190314
Abstract (en)
The present invention provides a bamboo strip substrate board and a preparation method thereof, a bamboo strip floor and application thereof, and relates to the technical field of floor manufacturing. The method for preparing a bamboo strip substrate board provided by the present invention includes the following steps: placing a bamboo strip curtain in a glue-containing solution for glue dipping and draining glue to obtain a glue-containing bamboo strip curtain; drying the glue-containing bamboo strip curtain and then performing assembly to obtain a bamboo strip board blank; and subjecting the bamboo strip board blank to hot pressing to obtain a bamboo strip substrate board. According to the present invention, an outdoor bamboo-based floor is further prepared on the basis of a bamboo strip substrate board. Since the bamboo strip retains the basic structure of the bamboo material, compared with a conventional reconsolidated bamboo, the bamboo strip has much lower density, less glue used, lower hot pressing pressure in the board forming process, and a simplified preparation process, so the production cost is effectively reduced, and the weather resistance of the floor is improved.
IPC 8 full level
B27N 1/00 (2006.01); B27N 3/00 (2006.01); B27N 3/02 (2006.01); B27N 3/18 (2006.01)
CPC (source: EP US)
B27N 1/00 (2013.01 - EP); B27N 3/002 (2013.01 - EP); B27N 3/02 (2013.01 - EP); B27N 3/18 (2013.01 - EP); B32B 7/12 (2013.01 - US); B32B 21/13 (2013.01 - US); B32B 37/02 (2013.01 - US); B32B 37/06 (2013.01 - US); B32B 37/10 (2013.01 - US); B32B 37/1284 (2013.01 - US); B32B 37/18 (2013.01 - US); B32B 38/164 (2013.01 - US); E04F 15/045 (2013.01 - US); B32B 2038/168 (2013.01 - US); B32B 2307/712 (2013.01 - US); B32B 2309/02 (2013.01 - US); B32B 2309/04 (2013.01 - US); B32B 2309/12 (2013.01 - US); B32B 2317/16 (2013.01 - US); B32B 2419/00 (2013.01 - US)
Citation (search report)
- [XYI] CN 1462676 A 20031224 - INST OF LUMBER INDUSTRY CHINES [CN]
- [XI] CN 101653956 A 20100224 - RENJIE ZHAO
- [XYI] CN 1101002 A 19950405 - WU DANREN [CN]
- [XI] US 2017356193 A1 20171214 - SONG JIANGANG [CN], et al
- [XI] CN 108748452 A 20181106 - ANHUI HONGRUN ARTS & CRAFTS CO LTD & DATABASE WPI Week 201881, Derwent World Patents Index; AN 2018-88645E
- [Y] CN 105235046 A 20160113 - UNIV KUNMING SCIENCE & TECHNOLOGY & DATABASE WPI Week 201641, Derwent World Patents Index; AN 2016-056000
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3708319 A1 20200916; CN 109773906 A 20190521; US 2020291663 A1 20200917
DOCDB simple family (application)
EP 19197979 A 20190918; CN 201910194060 A 20190314; US 201916657505 A 20191018