EP 3708941 A4 20210811 - COPPER POROUS BODY FOR VAPORIZATION MEMBERS, EVAPORATIVE COOLER AND HEAT PIPE
Title (en)
COPPER POROUS BODY FOR VAPORIZATION MEMBERS, EVAPORATIVE COOLER AND HEAT PIPE
Title (de)
PORÖSER KUPFERKÖRPER FÜR VERDAMPFUNGSELEMENTE, VERDAMPFUNGSKÜHLER UND WÄRMEROHR
Title (fr)
CORPS POREUX EN CUIVRE POUR ÉLÉMENTS DE VAPORISATION, REFROIDISSEUR PAR ÉVAPORATION ET CALODUC
Publication
Application
Priority
- JP 2017216634 A 20171109
- JP 2018037085 W 20181003
Abstract (en)
[origin: US2020224976A1] This copper porous body for vaporization members is a copper porous body for vaporization members used as a vaporization member which vaporizes a liquid phase medium that comes into contact with the vaporization member, the copper body is composed of a sintered body of a plurality of copper fibers, and has a stem having a three-dimensional network structure. A porosity is in a range of 65% or more and 95% or less, an opening diameter is in a range of 100 μm or more and 2,000 μm or less, and a standardized specific surface area SD=S×R defined as a product of a specific surface area S (m2/g) and a diameter R (m) of the copper fiber is in a range of 0.001 or more and 0.25 or less.
IPC 8 full level
F28D 15/04 (2006.01); F28D 15/02 (2006.01); F28F 21/08 (2006.01)
CPC (source: EP US)
B22F 3/002 (2013.01 - EP US); B22F 3/1103 (2013.01 - EP); F28D 15/046 (2013.01 - EP US); F28F 21/085 (2013.01 - EP US); B22F 2301/10 (2013.01 - US); F28F 2255/18 (2013.01 - EP)
Citation (search report)
- [X] JP 2017197811 A 20171102 - MITSUBISHI MATERIALS CORP
- [X] JP 2017002374 A 20170105 - MITSUBISHI MATERIALS CORP
- [A] EP 3165864 A1 20170510 - MITSUBISHI MATERIALS CORP [JP]
- [AD] JP 2013243249 A 20131205 - DENSO CORP
- See references of WO 2019093028A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 2020224976 A1 20200716; CN 111566431 A 20200821; EP 3708941 A1 20200916; EP 3708941 A4 20210811; JP 2019086259 A 20190606; TW 201924003 A 20190616; WO 2019093028 A1 20190516
DOCDB simple family (application)
US 201816647720 A 20181003; CN 201880067853 A 20181003; EP 18877002 A 20181003; JP 2017216634 A 20171109; JP 2018037085 W 20181003; TW 107135499 A 20181009