EP 3716010 B1 20230705 - SNAP-ON ELECTROMAGNETIC INTERFERENCE (EMI)-SHIELDING WITHOUT MOTHERBOARD GROUND REQUIREMENT
Title (en)
SNAP-ON ELECTROMAGNETIC INTERFERENCE (EMI)-SHIELDING WITHOUT MOTHERBOARD GROUND REQUIREMENT
Title (de)
EINRASTENDE ELEKTROMAGNETISCHE INTERFERENZ(EMI)-ABSCHIRMUNG OHNE ERDUNGSANFORDERUNGEN DER HAUPTPLATINE
Title (fr)
PROTECTION D'INTERFÉRENCE ÉLECTROMAGNÉTIQUE (EMI) ENCLIQUETABLE SANS EXIGENCE DE MISE À LA TERRE DE LA CARTE MÈRE
Publication
Application
Priority
US 201916370665 A 20190329
Abstract (en)
[origin: US2019229473A1] A device includes a printed circuit board (PCB) and a shield for the PCB. The shield can reduce high frequency electromagnetic frequency (EMF) noise generated by one or more components of the PCB. The PCB includes pads to interface with a corresponding connector. For example, for a dual inline memory module (DIMM) PCB, the PCB includes pads to insert into a DIMM connector. The shield includes a gap in its perimeter that aligns with clips in the corresponding connector. The gaps will correspond to similar features of the PCB that interface with the corresponding connector to allow the shield to attach to the PCB. The shield includes lock fingers to extend from a connector-facing edge of the shield to interface with the corresponding connector to align the shield with the corresponding connector.
IPC 8 full level
G06F 1/18 (2006.01); H01R 13/6595 (2011.01); H01R 13/6596 (2011.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 9/00 (2006.01)
CPC (source: CN EP KR US)
G06F 1/182 (2013.01 - EP KR); G11C 5/04 (2013.01 - KR); H01R 12/721 (2013.01 - KR US); H01R 13/6581 (2013.01 - KR US); H01R 13/6595 (2013.01 - EP KR US); H01R 13/6596 (2013.01 - EP KR US); H05K 1/0216 (2013.01 - EP); H05K 1/0218 (2013.01 - CN KR); H05K 1/117 (2013.01 - KR US); H05K 1/141 (2013.01 - KR); H05K 1/181 (2013.01 - KR); H05K 9/0018 (2013.01 - US); H05K 9/0022 (2013.01 - CN); H05K 9/0024 (2013.01 - US); H05K 9/0028 (2013.01 - EP KR US); H05K 9/0064 (2013.01 - KR); H05K 9/0081 (2013.01 - CN); H05K 1/141 (2013.01 - EP); H05K 1/181 (2013.01 - US); H05K 2201/0367 (2013.01 - EP KR); H05K 2201/09163 (2013.01 - KR US); H05K 2201/09354 (2013.01 - EP KR); H05K 2201/10159 (2013.01 - EP KR US); H05K 2201/10189 (2013.01 - EP KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 10938161 B2 20210302; US 2019229473 A1 20190725; CN 111757587 A 20201009; EP 3716010 A1 20200930; EP 3716010 B1 20230705; JP 2020167381 A 20201008; JP 7467818 B2 20240416; KR 20200115119 A 20201007
DOCDB simple family (application)
US 201916370665 A 20190329; CN 202010130858 A 20200228; EP 20158317 A 20200219; JP 2020019063 A 20200206; KR 20200024416 A 20200227