EP 3734660 A4 20210224 - IMAGING ELEMENT
Title (en)
IMAGING ELEMENT
Title (de)
BILDGEBUNGSELEMENT
Title (fr)
ÉLÉMENT D'IMAGERIE
Publication
Application
Priority
- US 201762610806 P 20171227
- JP 2018036417 W 20180928
- JP 2018048364 W 20181227
Abstract (en)
[origin: WO2019130702A1] An image pickup device relating to one embodiment of the present disclosure is configured by laminating a first substrate, a second substrate, and a third substrate in this order. The first substrate having a sensor pixel that performs photoelectric conversion, and the second substrate having a readout circuit are electrically connected to each other by means of first through wiring that is provided in an interlayer insulating film. The second substrate and the third substrate having a logic circuit are electrically connected to each other by joining pad electrodes to each other or by means of second through wiring penetrating the semiconductor substrate.
IPC 8 full level
H01L 27/146 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H04N 5/369 (2011.01)
CPC (source: EP KR US)
H01L 25/065 (2013.01 - KR); H01L 25/07 (2013.01 - KR); H01L 25/167 (2013.01 - EP); H01L 25/18 (2013.01 - KR); H01L 27/14603 (2013.01 - EP); H01L 27/14634 (2013.01 - EP US); H01L 27/14636 (2013.01 - EP US); H01L 27/14638 (2013.01 - EP); H01L 27/156 (2013.01 - KR); H04N 25/70 (2023.01 - KR); H04N 25/75 (2023.01 - US); H04N 25/778 (2023.01 - EP US); H04N 25/79 (2023.01 - EP US); H01L 27/14612 (2013.01 - EP); H01L 27/1464 (2013.01 - EP); H01L 27/14641 (2013.01 - EP); H01L 2224/08145 (2013.01 - EP)
Citation (search report)
- [XI] US 2014042298 A1 20140213 - WAN MENG-HSUN [TW], et al
- [X] US 2017229509 A1 20170810 - LEE HONG-WEI [US], et al
- See also references of WO 2019131965A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 112018006695 T5 20200903; CN 111492484 A 20200804; CN 118173567 A 20240611; EP 3734660 A1 20201104; EP 3734660 A4 20210224; EP 4372821 A2 20240522; EP 4372821 A3 20240619; JP 2023086799 A 20230622; JP WO2019131965 A1 20210114; KR 20200097716 A 20200819; TW 201931584 A 20190801; TW I806909 B 20230701; US 11600651 B2 20230307; US 11798972 B2 20231024; US 2021084249 A1 20210318; US 2023154964 A1 20230518; US 2023420478 A1 20231228; WO 2019130702 A1 20190704; WO 2019131965 A1 20190704
DOCDB simple family (application)
DE 112018006695 T 20181227; CN 201880081214 A 20181227; CN 202410156586 A 20181227; EP 18896152 A 20181227; EP 24153855 A 20181227; JP 2018036417 W 20180928; JP 2018048364 W 20181227; JP 2019562483 A 20181227; JP 2023065142 A 20230412; KR 20207016779 A 20181227; TW 107136890 A 20181019; US 201816956141 A 20181227; US 202218064794 A 20221212; US 202318368146 A 20230914