EP 3740120 A1 20201125 - MEMS DEVICE FOR AN IMPLANT ASSEMBLY
Title (en)
MEMS DEVICE FOR AN IMPLANT ASSEMBLY
Title (de)
MEMS-VORRICHTUNG FÜR EINE IMPLANTATANORDNUNG
Title (fr)
DISPOSITIF MEMS POUR ENSEMBLE IMPLANT
Publication
Application
Priority
- US 201862618848 P 20180118
- US 2019014108 W 20190118
Abstract (en)
[origin: WO2019143876A1] Disclosed is an implant and method of making an implant. The implant having a housing that defines a cavity. The housing includes a sensor comprising a base attached to a diaphragm wherein said base may be positioned within said cavity. The sensor may be a capacitive pressure sensor. The diaphragm may be connected to the housing to hermetically seal said housing. The sensor may include electrical contacts positioned on the diaphragm. The attachment between the base and the diaphragm may define a capacitive gap and at least one discontinuity configured to enhance at least one performance parameter of said implant.
IPC 8 full level
A61B 5/00 (2006.01); A61B 5/0215 (2006.01)
CPC (source: EP)
A61B 5/02152 (2013.01); A61B 5/686 (2013.01); A61B 2562/0247 (2013.01); A61B 2562/028 (2013.01)
Citation (search report)
See references of WO 2019143876A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2019143876 A1 20190725; AU 2019209962 A1 20200709; CA 3087275 A1 20190725; EP 3740120 A1 20201125
DOCDB simple family (application)
US 2019014108 W 20190118; AU 2019209962 A 20190118; CA 3087275 A 20190118; EP 19706323 A 20190118