EP 3750217 A1 20201216 - COMPONENT ARRANGEMENT, PACKAGE AND PACKAGE ARRANGEMENT, AS WELL AS PRODUCTION METHOD
Title (en)
COMPONENT ARRANGEMENT, PACKAGE AND PACKAGE ARRANGEMENT, AS WELL AS PRODUCTION METHOD
Title (de)
BAUTEILANORDNUNG, PACKAGE UND PACKAGE-ANORDNUNG SOWIE VERFAHREN ZUM HERSTELLEN
Title (fr)
ENSEMBLE DE COMPOSANT, EMBALLAGE ET ENSEMBLE D'EMBALLAGE AINSI QUE PROCÉDÉ DE FABRICATION
Publication
Application
Priority
- DE 102018102961 A 20180209
- DE 2019100130 W 20190211
Abstract (en)
[origin: WO2019154465A1] The invention relates to a component arrangement, comprising a carrier substrate (1); a spacer (3) which is arranged on the carrier substrate surrounding an installation space (1a) and has an outlet opening on a side facing away from the carrier substrate; an optical component (2) arranged in the installation space; a contact connection which electrically conductively connects the optical component to external contacts arranged outside the installation space; a cover substrate (4) which is arranged on the spacer and with which the outlet opening is covered in a light-permeable manner; and a light-reflecting surface (6) which forms an anisotropically etched silicon component and is arranged in the installation space as an inclined surface at an angle of approx. 45° relative to the surface of the carrier substrate facing the installation space, in such a way that light radiating in in a horizontal direction onto the light-reflecting surface can be radiated out in the vertical direction through the opening and the cover substrate, and vice versa. The invention also relates to a method for producing a component arrangement, as well as a package, a package arrangement and a production method.
IPC 8 full level
H01S 5/022 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 33/48 (2010.01)
CPC (source: EP KR US)
H01L 31/0203 (2013.01 - EP KR US); H01L 31/02327 (2013.01 - US); H01L 33/486 (2013.01 - EP KR US); H01L 33/60 (2013.01 - EP KR US); H01L 33/62 (2013.01 - KR); H01S 5/02216 (2013.01 - EP KR US); H01S 5/02255 (2021.01 - EP KR US); H01S 5/02257 (2021.01 - KR); H01S 5/02345 (2021.01 - KR US); H01S 5/0237 (2021.01 - KR US); H01L 24/32 (2013.01 - US); H01L 24/48 (2013.01 - US); H01L 24/73 (2013.01 - US); H01L 31/02005 (2013.01 - US); H01L 33/62 (2013.01 - EP US); H01L 2224/32225 (2013.01 - US); H01L 2224/48091 (2013.01 - EP KR US); H01L 2224/48227 (2013.01 - US); H01L 2224/73265 (2013.01 - EP KR US); H01L 2224/97 (2013.01 - EP KR); H01L 2924/16195 (2013.01 - EP KR); H01L 2933/0033 (2013.01 - EP KR); H01L 2933/0058 (2013.01 - EP KR US); H01S 5/02257 (2021.01 - EP); H01S 5/02345 (2021.01 - EP); H01S 5/0237 (2021.01 - EP)
Citation (search report)
See references of WO 2019154465A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102018102961 A1 20190814; DE 102018102961 A9 20191205; CN 111837298 A 20201027; EP 3750217 A1 20201216; JP 2021513226 A 20210520; KR 20200117000 A 20201013; US 2022310890 A1 20220929; WO 2019154465 A1 20190815
DOCDB simple family (application)
DE 102018102961 A 20180209; CN 201980012428 A 20190211; DE 2019100130 W 20190211; EP 19712126 A 20190211; JP 2020542783 A 20190211; KR 20207025664 A 20190211; US 201916967759 A 20190211