EP 3754726 A4 20210908 - INTEGRATED PHOTOSENSITIVE MODULE, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND PREPARATION METHOD THEREFOR
Title (en)
INTEGRATED PHOTOSENSITIVE MODULE, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND PREPARATION METHOD THEREFOR
Title (de)
INTEGRIERTES LICHTEMPFINDLICHES MODUL, LICHTEMPFINDLICHE ANORDNUNG, KAMERAMODUL UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
MODULE PHOTOSENSIBLE INTÉGRÉ, ENSEMBLE PHOTOSENSIBLE, MODULE DE CAMÉRA ET SON PROCÉDÉ DE PRÉPARATION
Publication
Application
Priority
- CN 201810150993 A 20180213
- CN 2019074905 W 20190213
Abstract (en)
[origin: EP3754726A1] Disclosed is a photosensitive module (21), adapted to a camera module, comprising a photosensitive element (211), a light transmitting element (212) and an isolation adhesive layer (213), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.
IPC 8 full level
H01L 31/0203 (2014.01); H01L 27/146 (2006.01)
CPC (source: CN EP US)
H01L 27/14601 (2013.01 - CN); H01L 27/14618 (2013.01 - EP US); H01L 27/14625 (2013.01 - CN US); H01L 27/14683 (2013.01 - CN); H01L 27/14685 (2013.01 - US); H01L 27/14687 (2013.01 - US); H01L 31/0203 (2013.01 - CN EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3754726 A1 20201223; EP 3754726 A4 20210908; CN 110164984 A 20190823; CN 110164984 B 20240209; US 2020403017 A1 20201224; US 2023207588 A1 20230629; WO 2019158061 A1 20190822
DOCDB simple family (application)
EP 19755047 A 20190213; CN 201810150993 A 20180213; CN 2019074905 W 20190213; US 201916969293 A 20190213; US 202318118264 A 20230307