Global Patent Index - EP 3755824 A1

EP 3755824 A1 20201230 - DEVICE FOR ELECTROLESS METALLIZATION OF A TARGET SURFACE OF AT LEAST ONE WORKPIECE

Title (en)

DEVICE FOR ELECTROLESS METALLIZATION OF A TARGET SURFACE OF AT LEAST ONE WORKPIECE

Title (de)

VORRICHTUNG ZUR STROMLOSEN METALLISIERUNG EINER ZIELOBERFLÄCHE WENIGSTENS EINES WERKSTÜCKS

Title (fr)

DISPOSITIF POUR LA MÉTALLISATION SANS COURANT D'UNE SURFACE CIBLE D'AU MOINS UNE PIÈCE

Publication

EP 3755824 A1 20201230 (DE)

Application

EP 19702073 A 20190127

Priority

  • DE 102018103808 A 20180220
  • EP 2019051929 W 20190127

Abstract (en)

[origin: WO2019162042A1] Arrangement for electroless metallization of a target surface (3) of at least one workpiece (2) comprising - a container (5) for receiving a metallization solution (7) - an inlet (8), arranged in the bottom (6) of the container, for the metallization solution (7), - an outlet, arranged on the upper side of the container (5), for the metallization solution (7), - a mount (11) for mounting (11) the at least one workpiece (2), wherein the mount is arranged movably in relation to the container (5) in at least two dimensions by means of a moving device (13).

IPC 8 full level

C23C 18/16 (2006.01); B05C 3/04 (2006.01)

CPC (source: EP US)

C23C 18/1628 (2013.01 - EP); C23C 18/163 (2013.01 - EP US); C23C 18/1669 (2013.01 - EP US); B05C 3/09 (2013.01 - EP)

Citation (search report)

See references of WO 2019162042A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

DE 102018103808 A1 20190822; CN 111836917 A 20201027; EP 3755824 A1 20201230; US 2021079529 A1 20210318; WO 2019162042 A1 20190829

DOCDB simple family (application)

DE 102018103808 A 20180220; CN 201980014985 A 20190127; EP 19702073 A 20190127; EP 2019051929 W 20190127; US 201916970072 A 20190127