EP 3766097 A4 20220413 - PLANARIZATION FOR SEMICONDUCTOR DEVICE PACKAGE FABRICATION PROCESSES
Title (en)
PLANARIZATION FOR SEMICONDUCTOR DEVICE PACKAGE FABRICATION PROCESSES
Title (de)
PLANARISIERUNG FÜR VERFAHREN ZUR HERSTELLUNG VON HALBLEITERBAUELEMENTGEHÄUSEN
Title (fr)
PLANARISATION POUR PROCESSUS DE FABRICATION DE BOÎTIER DE DISPOSITIF À SEMI-CONDUCTEUR
Publication
Application
Priority
- US 201862643222 P 20180315
- US 2019018154 W 20190215
Abstract (en)
[origin: WO2019177742A1] A method of electronic device package fabrication includes dispensing a planarizing liquid into a region between adjacent features that protrude from a substrate. The planarizing liquid is then processed to provide a hardened, substantially solid material in the region between adjacent features. In some examples, the planarizing liquid can be a dielectric material used in the formation of multilevel redistribution layers or a packaging resin material used for packaging semiconductor chips. A planarization apparatus of an example includes a substrate support, a liquid dispensing system configured to dispense the planarizing liquid onto the substrate, a hardening system for hardening the planarizing liquid, and a planar element system to press into the planarizing liquid.
IPC 8 full level
H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP KR)
H01L 21/56 (2013.01 - EP KR); H01L 21/561 (2013.01 - EP); H01L 21/565 (2013.01 - EP); H01L 23/293 (2013.01 - KR); H01L 23/31 (2013.01 - KR); H01L 23/3114 (2013.01 - EP)
Citation (search report)
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- [XAYI] US 2012126395 A1 20120524 - LEE KYUNGHOON [KR], et al
- [XAI] US 2016148887 A1 20160526 - YU CHEN-HUA [TW], et al
- [XAI] US 2009179317 A1 20090716 - IIDA ATSUKO [JP], et al
- [IAY] US 2011115125 A1 20110519 - MANIKAM VERMAL RAJA [MY], et al
- [A] US 2015357256 A1 20151210 - SUTHIWONGSUNTHORN NATHAPONG [SG], et al
- [XA] JP 2011032436 A 20110217 - NITTO DENKO CORP
- [I] US 2016126286 A1 20160505 - IGARASHI TAKATOSHI [JP], et al
- [A] US 2009209052 A1 20090820 - VAL CHRISTIAN [FR]
- See references of WO 2019177742A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2019177742 A1 20190919; CN 111868920 A 20201030; EP 3766097 A1 20210120; EP 3766097 A4 20220413; JP 2021517360 A 20210715; JP 7258906 B2 20230417; KR 102521991 B1 20230413; KR 20200120766 A 20201021; TW 201946162 A 20191201; TW I717690 B 20210201
DOCDB simple family (application)
US 2019018154 W 20190215; CN 201980019163 A 20190215; EP 19766870 A 20190215; JP 2020547376 A 20190215; KR 20207029381 A 20190215; TW 108105230 A 20190218