Global Patent Index - EP 3766310 A1

EP 3766310 A1 20210120 - METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD USING A MOULD FOR CONDUCTOR ELEMENTS

Title (en)

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD USING A MOULD FOR CONDUCTOR ELEMENTS

Title (de)

VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE UNTER VERWENDUNG EINER FORM FÜR LEITERELEMENTE

Title (fr)

PROCÉDÉ DE FABRICATION D'UNE CARTE DE CIRCUIT IMPRIMÉ À L'AIDE D'UN MOULE POUR ÉLÉMENTS CONDUCTEURS

Publication

EP 3766310 A1 20210120 (DE)

Application

EP 19710657 A 20190311

Priority

  • DE 102018203715 A 20180312
  • DE 202018106030 U 20181022
  • EP 2019055991 W 20190311

Abstract (en)

[origin: WO2019175090A1] The present invention relates to a method for producing a printed circuit board having at least one conductor element which extends between connection points in the printed circuit board. In order to increase the productivity of the known method for producing a printed circuit board having at least one conductor element which extends between connection points in the printed circuit board, the method according to claim 1 comprises the following steps: - Step A: providing a mould (3) having at least one receptacle (3c) for a conductor element (2). - Step B: arranging a conductor element (2) in the receptacle (3c) of the mould (3). - Step C: connecting the conductor element (2), which is arranged in the receptacle (3c) of the mould (3), to an electrically conductive sheet-like element (5) at positions of the intended connection points. - Step D: embedding the conductor element (2), which is connected to the electrically conductive sheet-like element (5), in insulating material (4). - Step E: working the connection points out of the electrically conductive sheet-like element (5).

IPC 8 full level

G01R 1/20 (2006.01); H01C 7/06 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01)

CPC (source: EP KR US)

G01R 1/203 (2013.01 - EP KR); G01R 3/00 (2013.01 - EP KR); H01C 7/06 (2013.01 - EP KR); H05K 1/0265 (2013.01 - EP KR); H05K 1/167 (2013.01 - EP KR); H05K 1/188 (2013.01 - EP KR US); H05K 3/103 (2013.01 - EP KR US); H05K 3/107 (2013.01 - EP KR); H05K 3/328 (2013.01 - US); H05K 1/113 (2013.01 - EP KR); H05K 3/328 (2013.01 - EP KR); H05K 2201/10022 (2013.01 - EP KR US); H05K 2201/10272 (2013.01 - EP KR); H05K 2201/1028 (2013.01 - EP KR); H05K 2201/10287 (2013.01 - EP KR); H05K 2201/10416 (2013.01 - EP KR); H05K 2203/0156 (2013.01 - EP KR); H05K 2203/0278 (2013.01 - EP KR US)

Citation (search report)

See references of WO 2019175090A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2019175090 A1 20190919; CN 111869334 A 20201030; EP 3766310 A1 20210120; JP 2021515990 A 20210624; JP 7244531 B2 20230322; KR 102413296 B1 20220627; KR 20200128432 A 20201112; US 11395411 B2 20220719; US 2021029831 A1 20210128

DOCDB simple family (application)

EP 2019055991 W 20190311; CN 201980018946 A 20190311; EP 19710657 A 20190311; JP 2020548764 A 20190311; KR 20207029175 A 20190311; US 201916980097 A 20190311