EP 3770452 A1 20210127 - SLIDING MEMBER
Title (en)
SLIDING MEMBER
Title (de)
GLEITELEMENT
Title (fr)
ÉLÉMENT COULISSANT
Publication
Application
Priority
JP 2019134392 A 20190722
Abstract (en)
A sliding member (1) includes a back-metal layer (2) including an Fe alloy and a sliding layer (3) including a copper alloy (4) including 0.5 to 12 mass% of Sn and the balance of Cu and inevitable impurities. The sliding layer (3) has a cross-sectional structure perpendicular to a sliding surface (31) of the sliding layer. The cross-sectional structure includes first copper alloy grains (41) that are in contact with a bonding surface (21) of the back-metal layer (2) and second copper alloy grains (42) that are not in contact with the bonding surface (21). The first copper alloy grains (41) has an average grain size D1 and the second copper alloy grains (42) has an average grain size D2. D1 and D2 satisfy the following relations: D1 is 30 to 80 µm; and D1/D2 = 0.1 to 0.3.
IPC 8 full level
F16C 33/12 (2006.01); B32B 15/01 (2006.01); C22C 9/02 (2006.01)
CPC (source: EP US)
B32B 15/015 (2013.01 - EP US); C22C 9/00 (2013.01 - US); C22C 9/02 (2013.01 - EP); F16C 33/121 (2013.01 - EP US); F16C 33/125 (2013.01 - EP); B32B 2311/12 (2013.01 - US); B32B 2311/30 (2013.01 - US); F16C 17/00 (2013.01 - US); F16C 33/00 (2013.01 - US); F16C 2204/12 (2013.01 - EP); F16C 2204/16 (2013.01 - EP); F16C 2204/18 (2013.01 - EP); F16C 2240/90 (2013.01 - EP); F16C 2360/22 (2013.01 - EP); Y02T 10/86 (2013.01 - EP)
Citation (applicant)
- JP H06322462 A 19941122 - DAIDO METAL CO LTD
- JP 2006022896 A 20060126 - DAIDO METAL CO LTD
- JP H09100882 A 19970415 - UNITED TECHNOLOGIES CORP
Citation (search report)
- [AD] JP 2006022896 A 20060126 - DAIDO METAL CO LTD
- [A] WO 2012098004 A1 20120726 - MAHLE INT GMBH [DE], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3770452 A1 20210127; EP 3770452 B1 20211117; JP 2021017936 A 20210215; JP 7227098 B2 20230221; US 11193536 B2 20211207; US 2021025450 A1 20210128
DOCDB simple family (application)
EP 20186686 A 20200720; JP 2019134392 A 20190722; US 202016931689 A 20200717