EP 3771749 A1 20210203 - METHOD FOR PASSIVATING METALLIC SUBSTRATES
Title (en)
METHOD FOR PASSIVATING METALLIC SUBSTRATES
Title (de)
VERFAHREN ZUR PASSIVIERUNG METALLISCHER SUBSTRATE
Title (fr)
PROCÉDÉ DE PASSIVATION DE SUBSTRATS MÉTALLIQUES
Publication
Application
Priority
EP 19188901 A 20190729
Abstract (en)
[origin: MX2020007981A] The present invention relates to a method for adjusting a passivation composition by determining the redox potential of a passivation composition as well as to a method for passivating metallic substrates by treatment with a passivation composition.
Abstract (de)
Die vorliegende Erfindung betrifft ein Verfahren zur Einstellung einer Passivierungszusammensetzung durch Bestimmung des Redoxpotentials Passivierungszusammensetzung sowie ein Verfahren zur Passiverung von metallischen Substraten durch Behandlung mit einer Passivierungszusammensetzung.
IPC 8 full level
C23C 22/44 (2006.01); C23C 22/46 (2006.01); C23C 22/77 (2006.01); C25D 5/48 (2006.01); C23C 22/78 (2006.01); C25D 3/22 (2006.01)
CPC (source: CN EP KR US)
C23C 22/06 (2013.01 - US); C23C 22/24 (2013.01 - KR); C23C 22/27 (2013.01 - KR); C23C 22/34 (2013.01 - KR); C23C 22/44 (2013.01 - CN EP); C23C 22/46 (2013.01 - EP); C23C 22/73 (2013.01 - CN); C23C 22/77 (2013.01 - EP); C25D 5/48 (2013.01 - EP); C23C 22/78 (2013.01 - EP); C23C 2222/10 (2013.01 - EP); C25D 3/22 (2013.01 - EP)
Citation (search report)
- [X] WO 9314241 A1 19930722 - HENKEL CORP [US]
- [X] WO 2004020700 A1 20040311 - HENKEL KGAA [DE], et al
- [X] JP 2006013158 A 20060112 - NAGASE & CO LTD, et al
- [X] JP 2009249736 A 20091029 - MITSUBISHI PAPER MILLS LTD
- [X] EP 3428314 A1 20190116 - DOERKEN EWALD AG [DE]
- [X] DE 102006040908 A1 20080306 - HILLEBRAND WALTER GMBH & CO KG [DE]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3771749 A1 20210203; CN 112301339 A 20210202; KR 20210014587 A 20210209; MX 2020007981 A 20210201; US 11987887 B2 20240521; US 2021032757 A1 20210204
DOCDB simple family (application)
EP 19188901 A 20190729; CN 202010744639 A 20200729; KR 20200093730 A 20200728; MX 2020007981 A 20200729; US 202016940820 A 20200728